Development of lead-free solders for hybrid microcircuits

PDF Version Also Available for Download.

Description

Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is ... continued below

Physical Description

10 p.

Creation Information

Hosking, F.M.; Vianco, P.T.; Frear, D.R. & Robinson, D.G. January 1, 1996.

Context

This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

Who

People and organizations associated with either the creation of this article or its content.

Sponsor

Publisher

  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this article. Follow the links below to find similar items on the Digital Library.

Description

Extensive work has been conducted by industry to develop lead-free solders for electronics applications. The driving force behind this effort is pressure to ban or tax the use of lead-bearing solders. There has been further interest to reduce the use of hazardous chemical cleaners. Lead-free soldering and low-residue, ``no clean`` assembly processing are being considered as solutions to these environmental issues. Most of the work has been directed toward commercial and military printed wiring board (PWB) technology, although similar problems confront the hybrid microcircuit (HMC) industry, where the development of lead-free HMC solders is generally lagging. Sandia National Laboratories is responsible for designing a variety of critical, high reliability hybrid components for radars. Sandia has consequently initiated a project, as part of its Environmentally Conscious Manufacturing program, to develop low-residue, lead-free soldering for HMCs. This paper discusses the progress of that work.

Physical Description

10 p.

Notes

OSTI as DE96004707

Source

  • National Electronic Producers conference, Orlando, FL (United States), 1-2 Nov 1995

Language

Item Type

Identifier

Unique identifying numbers for this article in the Digital Library or other systems.

  • Other: DE96004707
  • Report No.: SAND--96-0062C
  • Report No.: CONF-9511166--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 186727
  • Archival Resource Key: ark:/67531/metadc670299

Collections

This article is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

What responsibilities do I have when using this article?

When

Dates and time periods associated with this article.

Creation Date

  • January 1, 1996

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

Description Last Updated

  • April 13, 2016, 1:32 p.m.

Usage Statistics

When was this article last used?

Yesterday: 0
Past 30 days: 0
Total Uses: 5

Interact With This Article

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Hosking, F.M.; Vianco, P.T.; Frear, D.R. & Robinson, D.G. Development of lead-free solders for hybrid microcircuits, article, January 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc670299/: accessed October 18, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.