Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

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Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing ... continued below

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12 p.

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Vianco, P.; Rejent, J.; Artaki, I.; Ray, U.; Finley, D. & Jackson, A. March 1996.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 23 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Enhanced performance goals and environmental restrictions have heightened the consideration for use of alternative solders as replacements for the traditional tin-lead (Sn-Pb) eutectic and near-eutectic alloys. However, the implementation of non-Pb bearing surface finishes may lag behind solder alloy development. A study was performed which examined the effect(s) of Pb contamination on the performance of Sn-Ag-Bi and Sn-Ag-Cu-Sb lead-free solders by the controlled addition of 63Sn-37Pb solder at levels of 0.5 {minus} 8.0 wt.%. Thermal analysis and ring-in-plug shear strength studies were conducted on bulk solder properties. Circuit board prototype studies centered on the performance of 20I/O SOIC gull wing joints. Both alloys exhibited declines in their melting temperatures with greater Sn-Pb additions. The ring-in-plug shear strength of the Sn-Ag-Cu-Sb solder increased slightly with Sn-Pb levels while the Sn-Ag-Bi alloy experienced a strength loss. The mechanical behavior of the SOIC (Small Outline Integrated Circuit) Sn-Ag-Bi solder joints reproduced the strength levels were insensitive to 10,106 thermal cycles. The Sn-Ag-Cu-Sb solder showed a slight decrease in the gull wing joint strengths that was sensitive to the Pb content of the surface finish.

Physical Description

12 p.

Notes

OSTI as DE96006464

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  • IEEE electronic components and technology conference, Orlando, FL (United States), 28-31 May 1996

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  • Other: DE96006464
  • Report No.: SAND--96-0455C
  • Report No.: CONF-9605101--2
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 219457
  • Archival Resource Key: ark:/67531/metadc668943

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  • March 1996

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  • June 29, 2015, 9:42 p.m.

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  • Nov. 19, 2015, 4:26 p.m.

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Vianco, P.; Rejent, J.; Artaki, I.; Ray, U.; Finley, D. & Jackson, A. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies, article, March 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc668943/: accessed September 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.