Combining the Best of Bulk and Surface Micromaching Using Si(111) Substrates

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Description

This process combines the best features of bulk ad surface micromachining. It enables the production of stress free, thick, virtually arbitrarily shaped structures with well defiti thick or thin sacrificial layers, high sacrificial layer selectivity and large undercuts using IC compatible, processes. The basis of this approach is the use of dy available {111} oriented substrates. anisotropic Si trench etching, S iN masking and KOH etching.

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Fleming, J.G. November 30, 1998.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Laboratories, Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

This process combines the best features of bulk ad surface micromachining. It enables the production of stress free, thick, virtually arbitrarily shaped structures with well defiti thick or thin sacrificial layers, high sacrificial layer selectivity and large undercuts using IC compatible, processes. The basis of this approach is the use of dy available {111} oriented substrates. anisotropic Si trench etching, S iN masking and KOH etching.

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  • Micromachining and Microfabrication; Sata Clara, CA; 09/20/1998

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  • Other: DE00002190
  • Report No.: SAND98-2739C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 2190
  • Archival Resource Key: ark:/67531/metadc668811

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Office of Scientific & Technical Information Technical Reports

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Creation Date

  • November 30, 1998

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • Nov. 22, 2016, 10:48 p.m.

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Fleming, J.G. Combining the Best of Bulk and Surface Micromaching Using Si(111) Substrates, article, November 30, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc668811/: accessed August 22, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.