Development of a new Pb-free solder: Sn-Ag-Cu

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Description

With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and ... continued below

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94 p.

Creation Information

Miller, C.M. February 10, 1995.

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  • Ames Laboratory
    Publisher Info: Ames Lab., IA (United States)
    Place of Publication: Iowa

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Description

With the ever increasing awareness of the toxicity of Pb, significant pressure has been put on the electronics industry to get the Pb out of solder. This work pertains to the development and characterization of an alloy which is Pb-free, yet retains the proven positive qualities of current Sn-Pb solders while enhancing the shortcomings of Sn-Pb solder. The solder studied is the Sn-4.7Ag-1.7Cu wt% alloy. By utilizing a variety of experimental techniques the alloy was characterized. The alloy has a melting temperature of 217{degrees}C and exhibits eutectic melting behavior. The solder was examined by subjecting to different annealing schedules and examining the microstructural stability. The effect of cooling rate on the microstructure of the solder was also examined. Overall, this solder alloy shows great promise as a viable alternative to Pb-bearing solders and, as such, an application for a patent has been filed.

Physical Description

94 p.

Notes

OSTI as DE96006802

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  • Other Information: TH: Thesis (Ph.D.)

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  • Other: DE96006802
  • Report No.: IS-T--1728
  • Grant Number: W-7405-ENG-82
  • Office of Scientific & Technical Information Report Number: 208383
  • Archival Resource Key: ark:/67531/metadc668123

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • February 10, 1995

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • Nov. 30, 2015, 7:26 p.m.

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Miller, C.M. Development of a new Pb-free solder: Sn-Ag-Cu, thesis or dissertation, February 10, 1995; Iowa. (digital.library.unt.edu/ark:/67531/metadc668123/: accessed September 25, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.