Material development of polymer/metal paste for flip-chip attach interconnection technology. Quarterly progress report, December 1, 1995--March 31, 1996 Page: 1 of 25
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ARPA-DOE Quarterly Report
Material Development of Polymer/Metal Paste for
Flip-Chip Attach Interconnection Technology
R.F. Saraf (1), J.M. Roldan, C.J. Sambucetti,
T.J. Watson Research Center, IBM Corp., Yorktown Heights, NY 10598
Abstract
In this report on Polymer/Metal Composite (PMC) adhesive we describe two aspects
of the material that are crucial to its applicability as a viable material for Flip Chip At-
tach (FCA) technology. We describe the shelf-life of the material at room temperature
and its effect on the adhesion. Then we discuss the electrical and mechanical behavior
of PMC bond under strain. It is demonstrated that the bond can be subjected to well over
40% strain with insignificant change in its electrical properties.
Introduction: Background and Motivation
The major challenges to develop a Flip Chip Attach (FCA) structure using a
polymer/metal composite (PMC) adhesive falls into two categories:
" The PMC material and its precursor paste
" The process to obtain the FCA structure
The material challenges for obtaining a PMC material with appropriate
conductivity, rheology and bonding characteristics have been discussed before (2-5).
From the reliability measurements and the 4-point probe measurements (2,4) the bulk
conductivity of PMC is better than solder and the contact resistance is comparable to
solder. The rheological characterization of the material reported that the viscous behavior
of the paste is shear thinning with a much larger decrease in viscosity with shear rate
than other commercially available conductive adhesives (6). The elastic effect of the
paste, inducing the "hole-effect" is reasonably low (6). Since, the FCA structure will
MASTER
Saraf-Yorktown 1 DOE Conract No. DE-FC04-94AL98817
DISTRIBUTION OF THIS DOCUMENT IS UNLIMITED A
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Saraf, R. F.; Roldan, J. M. & Sambucetti, C. J. Material development of polymer/metal paste for flip-chip attach interconnection technology. Quarterly progress report, December 1, 1995--March 31, 1996, report, May 1, 1996; United States. (https://digital.library.unt.edu/ark:/67531/metadc667891/m1/1/: accessed April 23, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.