Thermal contact resistance for a CU/G-10CR interface in a cylindrical geometry

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Description

A major component of a high-T[sub c] superconductor current lead designed to provide current to low-T[sub c] superconductor magnets is the heat intercept connection, which is a cylindrical structure consisting of an inner Cu disk, a thin-walled G-10CR composite tube, and an outer Cu ring, assembled by a thermal interference fit. It was determined in a previous study that the thermal contact resistance (R[sub c]) between the composite tube and the two Cu pieces contributed a substantial portion of the total thermal resistance between the inner and outer Cu pieces. This report emphasizes the analysis of the data for the ... continued below

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7 p.

Creation Information

Phelan, P.E.; Niemann, R.C. & Nicol, T.H. July 1, 1996.

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  • Phelan, P.E. Arizona State Univ., Tempe, AZ (United States)
  • Niemann, R.C. Argonne National Lab., IL (United States)
  • Nicol, T.H. Chicago Univ., IL (United States). Enrico Fermi Inst.

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Description

A major component of a high-T[sub c] superconductor current lead designed to provide current to low-T[sub c] superconductor magnets is the heat intercept connection, which is a cylindrical structure consisting of an inner Cu disk, a thin-walled G-10CR composite tube, and an outer Cu ring, assembled by a thermal interference fit. It was determined in a previous study that the thermal contact resistance (R[sub c]) between the composite tube and the two Cu pieces contributed a substantial portion of the total thermal resistance between the inner and outer Cu pieces. This report emphasizes the analysis of the data for the third and final design of the heat intercept connection. In particular, it is found that R[sub c] decreases dramatically with increasing heat flux, a result consistent with earlier studies of composite cylinders. However, for the present data, the thermal contact conductance [=1/R{sub c}]varies with the calculated contact pressure with a power-law exponent of approximately 10, as compared to a theoretical value near 1. In addition, the presence of He or N[sub 2] gas substantially reduces R [sub c] even though the contacting surfaces are coated with a thermal grease.

Physical Description

7 p.

Notes

OSTI as TI96012668

Source

  • 31. national heat transfer conference, Houston, TX (United States), 3-6 Aug 1996

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  • Other: TI96012668
  • Report No.: ANL/ET/CP--88211
  • Report No.: CONF-960815--8
  • Grant Number: W-31109-ENG-38
  • DOI: 10.2172/285441 | External Link
  • Office of Scientific & Technical Information Report Number: 285441
  • Archival Resource Key: ark:/67531/metadc666155

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Creation Date

  • July 1, 1996

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • Aug. 23, 2016, 3:48 p.m.

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Phelan, P.E.; Niemann, R.C. & Nicol, T.H. Thermal contact resistance for a CU/G-10CR interface in a cylindrical geometry, report, July 1, 1996; Illinois. (digital.library.unt.edu/ark:/67531/metadc666155/: accessed September 23, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.