Low-power, parallel photonic interconnections for Multi-Chip Module applications

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Description

New applications of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs). Such applications will drive photonic link components into more compact forms that consume far less power than traditional telecommunication data links. MCM-based applications will also require simplified drive circuitry, lower cost, and higher reliability than has been demonstrated currently in photonic and optoelectronic technologies. The work described is a parallel link array, designed for vertical (Z-Axis) interconnection of the layers in a MCM-based signal processor stack, operating at a data rate of 100 Mb/s. This interconnect is based upon high-efficiency VCSELs, HBT photoreceivers, integrated ... continued below

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7 p.

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Carson, R.F.; Lovejoy, M.L. & Lear, K.L. December 31, 1994.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

New applications of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs). Such applications will drive photonic link components into more compact forms that consume far less power than traditional telecommunication data links. MCM-based applications will also require simplified drive circuitry, lower cost, and higher reliability than has been demonstrated currently in photonic and optoelectronic technologies. The work described is a parallel link array, designed for vertical (Z-Axis) interconnection of the layers in a MCM-based signal processor stack, operating at a data rate of 100 Mb/s. This interconnect is based upon high-efficiency VCSELs, HBT photoreceivers, integrated micro-optics, and MCM-compatible packaging techniques.

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7 p.

Notes

OSTI as DE95008518

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  • 45. electronic components and technology conference, Las Vegas, NV (United States), 22-26 May 1995

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  • Other: DE95008518
  • Report No.: SAND--94-2878C
  • Report No.: CONF-9505121--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 28420
  • Archival Resource Key: ark:/67531/metadc665647

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • December 31, 1994

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  • June 29, 2015, 9:42 p.m.

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  • April 14, 2016, 4:16 p.m.

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Carson, R.F.; Lovejoy, M.L. & Lear, K.L. Low-power, parallel photonic interconnections for Multi-Chip Module applications, article, December 31, 1994; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc665647/: accessed April 19, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.