New applications of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs). Such applications will drive photonic link components into more compact forms that consume far less power than traditional telecommunication data links. MCM-based applications will also require simplified drive circuitry, lower cost, and higher reliability than has been demonstrated currently in photonic and optoelectronic technologies. The work described is a parallel link array, designed for vertical (Z-Axis) interconnection of the layers in a MCM-based signal processor stack, operating at a data rate of 100 Mb/s. This interconnect is based upon high-efficiency VCSELs, HBT photoreceivers, integrated ...
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Sandia National Labs., Albuquerque, NM (United States)
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New applications of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs). Such applications will drive photonic link components into more compact forms that consume far less power than traditional telecommunication data links. MCM-based applications will also require simplified drive circuitry, lower cost, and higher reliability than has been demonstrated currently in photonic and optoelectronic technologies. The work described is a parallel link array, designed for vertical (Z-Axis) interconnection of the layers in a MCM-based signal processor stack, operating at a data rate of 100 Mb/s. This interconnect is based upon high-efficiency VCSELs, HBT photoreceivers, integrated micro-optics, and MCM-compatible packaging techniques.
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Carson, R.F.; Lovejoy, M.L. & Lear, K.L.Low-power, parallel photonic interconnections for Multi-Chip Module applications,
article,
December 31, 1994;
Albuquerque, New Mexico.
(digital.library.unt.edu/ark:/67531/metadc665647/:
accessed April 19, 2018),
University of North Texas Libraries, Digital Library, digital.library.unt.edu;
crediting UNT Libraries Government Documents Department.