Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems

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Description

We report here on the results of experiments concerning particular bonding processes potentially useful for ultimate miniaturization of microfluidic systems. Direct anodic bonding of continuous thin pyrex glass of 250 {mu}m thickness to silicon substrates gives multiple, large voids in the glass. Etchback of thick glass of 1200 {mu}m thickness bonded to silicon substrates gives thin continuous glass layers of 189 {mu}m thickness without voids over areas of 5 cm {times} 12 cm. Glass was also successfully bonded to glass by thermal bonding at 800{degrees}C over a 5 cm {times} 7 cm area. Anticipated applications include microfabricated DNA sequencing, flow ... continued below

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9 p.

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Raley, N.F.; Davidson, J.C. & Balch, J.W. October 23, 1995.

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Description

We report here on the results of experiments concerning particular bonding processes potentially useful for ultimate miniaturization of microfluidic systems. Direct anodic bonding of continuous thin pyrex glass of 250 {mu}m thickness to silicon substrates gives multiple, large voids in the glass. Etchback of thick glass of 1200 {mu}m thickness bonded to silicon substrates gives thin continuous glass layers of 189 {mu}m thickness without voids over areas of 5 cm {times} 12 cm. Glass was also successfully bonded to glass by thermal bonding at 800{degrees}C over a 5 cm {times} 7 cm area. Anticipated applications include microfabricated DNA sequencing, flow injection analysis, and liquid and gas chromatography microinstruments.

Physical Description

9 p.

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OSTI as DE96001321

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  • 1995 Society of Photo-Optical Instrumentation Engineers (SPIE) meeting, Austin, TX (United States), 23-24 Oct 1995

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  • Other: DE96001321
  • Report No.: UCRL-JC--120533
  • Report No.: CONF-9510196--2
  • Grant Number: W-7405-ENG-48
  • Office of Scientific & Technical Information Report Number: 119429
  • Archival Resource Key: ark:/67531/metadc627943

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Office of Scientific & Technical Information Technical Reports

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Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • October 23, 1995

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  • June 16, 2015, 7:43 a.m.

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  • Feb. 18, 2016, 5:01 p.m.

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Raley, N.F.; Davidson, J.C. & Balch, J.W. Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems, article, October 23, 1995; California. (digital.library.unt.edu/ark:/67531/metadc627943/: accessed January 16, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.