A study of adhesion at the E-glass/FR4 interface

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Description

The majority of printed circuit boards are copper clad laminates composed of fiberglass cloth impregnated with FR4 epoxy. An important factor affecting the reliability of these assemblies is the integrity of the epoxy/glass fiber interface. The goal of this work is to investigate mechanisms for the loss of adhesive strength between E-glass and FR4 epoxy upon humidity and temperature conditioning. In this paper the authors discuss the distribution of moisture between the interface region and the bulk epoxy examined by neutron reflection, and the relationship of this data to adhesive strength.

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7 p.

Creation Information

Kent, M. S.; Baca, P.; McNarama, W. F.; Jones, G.; Fein, D.; Wright, W. et al. November 1995.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 84 times , with 10 in the last month . More information about this report can be viewed below.

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Description

The majority of printed circuit boards are copper clad laminates composed of fiberglass cloth impregnated with FR4 epoxy. An important factor affecting the reliability of these assemblies is the integrity of the epoxy/glass fiber interface. The goal of this work is to investigate mechanisms for the loss of adhesive strength between E-glass and FR4 epoxy upon humidity and temperature conditioning. In this paper the authors discuss the distribution of moisture between the interface region and the bulk epoxy examined by neutron reflection, and the relationship of this data to adhesive strength.

Physical Description

7 p.

Notes

OSTI as DE96002075

Source

  • 27. international technical conference of the Society for the Advancement of Material and Process Engineering (SAMPE): diversity into the next century, Albuquerque, NM (United States), 9-12 Oct 1995

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  • Other: DE96002075
  • Report No.: SAND--95-2393C
  • Report No.: CONF-951033--24
  • Grant Number: AC04-94AL85000;W-31109-ENG-38
  • DOI: 10.2172/125094 | External Link
  • Office of Scientific & Technical Information Report Number: 125094
  • Archival Resource Key: ark:/67531/metadc626535

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • November 1995

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

Description Last Updated

  • Dec. 14, 2015, 12:58 p.m.

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Kent, M. S.; Baca, P.; McNarama, W. F.; Jones, G.; Fein, D.; Wright, W. et al. A study of adhesion at the E-glass/FR4 interface, report, November 1995; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc626535/: accessed November 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.