Challenges in the Packaging of MEMS

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Description

Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, ... continued below

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17 p.

Creation Information

BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O'NEAL, CHAD & SINGH, SUSHILA B. September 24, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 21 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circuit (IC) packaging. Many MEMS devices must interface to the environment in order to perform their intended function, and the package must be able to facilitate access with the environment while protecting the device. The package must also not interfere with or impede the operation of the MEMS device. The die attachment material should be low stress, and low outgassing, while also minimizing stress relaxation overtime which can lead to scale factor shifts in sensor devices. The fabrication processes used in creating the devices must be compatible with each other, and not result in damage to the devices. Many devices are application specific requiring custom packages that are not commercially available. Devices may also need media compatible packages that can protect the devices from harsh environments in which the MEMS device may operate. Techniques are being developed to handle, process, and package the devices such that high yields of functional packaged parts will result. Currently, many of the processing steps are potentially harmful to MEMS devices and negatively affect yield. It is the objective of this paper to review and discuss packaging challenges that exist for MEMS systems and to expose these issues to new audiences from the integrated circuit packaging community.

Physical Description

17 p.

Notes

OSTI as DE00012686

Medium: P; Size: 17 pages

Source

  • Journal Name: International Journal of Microelectronics and Packaging; Other Information: Submitted to International Journal of Microelectronics and Packaging

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  • Report No.: SAND99-2484J
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 12686
  • Archival Resource Key: ark:/67531/metadc626504

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • September 24, 1999

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

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  • April 7, 2017, 3:33 p.m.

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BROWN, WILLIAM D.; EATON, WILLIAM P.; MALSHE, AJAY P.; MILLER, WILLIAM M.; O'NEAL, CHAD & SINGH, SUSHILA B. Challenges in the Packaging of MEMS, article, September 24, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc626504/: accessed November 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.