Materials preparation and fabrication of pyroelectric polymer/silicon MOSFET detector arrays. Final report

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The authors have delivered several 64-element linear arrays of pyroelectric elements fully integrated on silicon wafers with MOS readout devices. They have delivered detailed drawings of the linear arrays to LANL. They have processed a series of two inch wafers per submitted design. Each two inch wafer contains two 64 element arrays. After spin-coating copolymer onto the arrays, vacuum depositing the top electrodes, and polarizing the copolymer films so as to make them pyroelectrically active, each wafer was split in half. The authors developed a thicker oxide coating separating the extended gate electrode (beneath the polymer detector) from the silicon. ... continued below

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16 p.

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Bloomfield, P. March 27, 1992.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 78 times . More information about this report can be viewed below.

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  • Bloomfield, P. Drexel Univ., Philadelphia, PA (United States). Dept. of Materials Engineering

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Description

The authors have delivered several 64-element linear arrays of pyroelectric elements fully integrated on silicon wafers with MOS readout devices. They have delivered detailed drawings of the linear arrays to LANL. They have processed a series of two inch wafers per submitted design. Each two inch wafer contains two 64 element arrays. After spin-coating copolymer onto the arrays, vacuum depositing the top electrodes, and polarizing the copolymer films so as to make them pyroelectrically active, each wafer was split in half. The authors developed a thicker oxide coating separating the extended gate electrode (beneath the polymer detector) from the silicon. This should reduce its parasitic capacitance and hence improve the S/N. They provided LANL three processed 64 element sensor arrays. Each array was affixed to a connector panel and selected solder pads of the common ground, the common source voltage supply connections, the 64 individual drain connections, and the 64 drain connections (for direct pyroelectric sensing response rather than the MOSFET action) were wire bonded to the connector panel solder pads. This entails (64 + 64 + 1 + 1) = 130 possible bond connections per 64 element array. This report now details the processing steps and the progress of the individual wafers as they were carried through from beginning to end.

Physical Description

16 p.

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INIS; OSTI as DE96000183

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  • Other Information: PBD: 27 Mar 1992

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  • Other: DE96000183
  • Report No.: LA-SUB--93-180
  • Grant Number: W-7405-ENG-36
  • DOI: 10.2172/106639 | External Link
  • Office of Scientific & Technical Information Report Number: 106639
  • Archival Resource Key: ark:/67531/metadc626215

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Office of Scientific & Technical Information Technical Reports

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  • March 27, 1992

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

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  • July 28, 2016, 7:37 p.m.

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Bloomfield, P. Materials preparation and fabrication of pyroelectric polymer/silicon MOSFET detector arrays. Final report, report, March 27, 1992; New Mexico. (digital.library.unt.edu/ark:/67531/metadc626215/: accessed June 23, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.