Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure

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Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by thermally-induced voltage alteration (TIVA), a new laser-based failure analysis technique to localize shorted interconnects. The results show that variations in TIVA thermal profiles are due mainly to preferential laser absorption in various locations in the test structure. Differences in oxide thickness also affect the local heat conduction and temperature distribution. Modeling results also show that local variation in heat conduction is less important than the absorbed laser power in determining the local temperatures since our test structure has feature sizes that are ... continued below

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page(s) 23

Creation Information

Benson, D.A.; Cole, E.I. Jr. & Tangyunyong, Paiboon September 16, 1999.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by thermally-induced voltage alteration (TIVA), a new laser-based failure analysis technique to localize shorted interconnects. The results show that variations in TIVA thermal profiles are due mainly to preferential laser absorption in various locations in the test structure. Differences in oxide thickness also affect the local heat conduction and temperature distribution. Modeling results also show that local variation in heat conduction is less important than the absorbed laser power in determining the local temperatures since our test structure has feature sizes that are small compared to the length over which heat spreads.

Physical Description

page(s) 23

Notes

OSTI as DE00012672

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  • Journal Name: Journal of Applied Physics

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  • Report No.: SAND99-2404J
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 12672
  • Archival Resource Key: ark:/67531/metadc625864

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  • September 16, 1999

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

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  • April 12, 2016, 12:59 p.m.

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Benson, D.A.; Cole, E.I. Jr. & Tangyunyong, Paiboon. Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure, article, September 16, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc625864/: accessed September 23, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.