Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory

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An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories are presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Our efforts are concentrated in the area of surface micromachining. Pressure sensors based on silicon nitride diaphragms and hot polysilicon filaments for calorimetric gas sensing have been developed. Accelerometers based upon high-aspect ratio surface micromachining are being developed. Actuation mechanisms employing either electrostatic or steam power are being combined with a three-level active (plus an additional passive level) polysilicon surface ... continued below

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6 p.

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Smith, J.H. August 1, 1995.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

An overview of the major sensor and actuator projects using the micromachining capabilities of the Microelectronics Development Laboratory at Sandia National Laboratories are presented. Development efforts are underway for a variety of micromechanical devices and control electronics for those devices. Our efforts are concentrated in the area of surface micromachining. Pressure sensors based on silicon nitride diaphragms and hot polysilicon filaments for calorimetric gas sensing have been developed. Accelerometers based upon high-aspect ratio surface micromachining are being developed. Actuation mechanisms employing either electrostatic or steam power are being combined with a three-level active (plus an additional passive level) polysilicon surface micromachining process to couple these actuators to external devices. The results of efforts toward integration of micromechanics with the driving electronics for actuators or the amplification/signal processing electronics for sensors is also described. This effort includes a CMOS-first, tungsten metallization process to allow the CMOS electronics to withstand high-temperature micromechanical processing. Also, a unique micromechanics-first approach is being pursued in which the micromechanical devices are embedded below the surface of the starting material for the CMOS.

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6 p.

Notes

OSTI as DE95016407

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  • Sensors Expo, Chicago, IL (United States), 12-14 Sep 1995

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  • Other: DE95016407
  • Report No.: SAND--95-1757C
  • Report No.: CONF-9509205--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 100183
  • Archival Resource Key: ark:/67531/metadc625171

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • August 1, 1995

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

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  • April 14, 2016, 5:47 p.m.

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Smith, J.H. Micromachined sensor and actuator research at Sandia`s Microelectronics Development Laboratory, article, August 1, 1995; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc625171/: accessed December 18, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.