Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer

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Description

We present a microelectronics fabrication compatible process that comprises photolithography and a key room temperature SiON thin film plasma deposition to define and seal a fluidic microduct network. Our single wafer process is independent of thermo-mechanical material properties, particulate cleaning, global flatness, assembly alignment, and glue medium application, which are crucial for wafer fusion bonding or sealing techniques using a glue medium. From our preliminary experiments, we have identified a processing window to fabricate channels on silicon, glass and quartz substrates. Channels with a radius of curvature between 8 and 50 {micro}m, are uniform along channel lengths of several inches ... continued below

Physical Description

9 p.

Creation Information

Matzke, C.M.; Ashby, C.I.; Bridges, M.M.; Griego, L. & Wong, C.C. September 7, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

We present a microelectronics fabrication compatible process that comprises photolithography and a key room temperature SiON thin film plasma deposition to define and seal a fluidic microduct network. Our single wafer process is independent of thermo-mechanical material properties, particulate cleaning, global flatness, assembly alignment, and glue medium application, which are crucial for wafer fusion bonding or sealing techniques using a glue medium. From our preliminary experiments, we have identified a processing window to fabricate channels on silicon, glass and quartz substrates. Channels with a radius of curvature between 8 and 50 {micro}m, are uniform along channel lengths of several inches and repeatable across the wafer surfaces. To further develop this technology, we have begun characterizing the SiON film properties such as elastic modulus using nanoindentation, and chemical bonding compatibility with other microelectronic materials.

Physical Description

9 p.

Notes

OSTI as DE00013994

Medium: P; Size: 9 pages

Source

  • SPIE Microelectronics-Micromachining 1999, Santa Clara, CA (US), 09/20/1999--09/22/1999

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  • Report No.: SAND99-2323C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 13994
  • Archival Resource Key: ark:/67531/metadc619791

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  • September 7, 1999

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

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  • April 11, 2017, 7:37 p.m.

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Matzke, C.M.; Ashby, C.I.; Bridges, M.M.; Griego, L. & Wong, C.C. Integratible Process for Fabrication of Fluidic Microduct Networks on a Single Wafer, article, September 7, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc619791/: accessed September 26, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.