An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder

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An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface ... continued below

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35 p.

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ARTAKI,I.; RAY,U.; REJENT,JEROME A. & VIANCO,PAUL T. September 1, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

An evaluation was performed which examined the aging of surface mount solder joints assembled with 91.84Sn-3.33Ag-4.83Bi solder. Defect analysis of the as-fabricated test vehicles revealed excellent solderability, good package alignment, and a minimum number of voids. Continuous DC electrical monitoring of the solder joints did not reveal opens during as many as 10,000 thermal cycles (0 C, 100 C). The solder joints exhibited no significant degradation through 2500 cycles, based upon an absence of microstructural damage and sustained shear and pull strengths of chip capacitors and J-leaded solder joints, respectively. Thermal cycles of 5000 and 10,000 resulted in some surface cracking of the solder fillets and coatings. In a few cases, deeper cracks were observed in the thinner reaches of several solder fillets. There was no deformation or cracking in the solder located in the gap between the package I/O and the circuit board pad nor in the interior of the fillets, both locations that would raise concerns of joint mechanical integrity. A drop in the chip capacitor shear strength was attributed to crack growth near the top of the fillet.

Physical Description

35 p.

Notes

OSTI as DE00013984

Medium: P; Size: 35 pages

Source

  • IPCWorks '99 Conference, Minneapolis, MN (US), 10/25/1999--10/27/1999

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  • Report No.: SAND99-2273C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 13984
  • Archival Resource Key: ark:/67531/metadc619654

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Office of Scientific & Technical Information Technical Reports

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Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • September 1, 1999

Added to The UNT Digital Library

  • June 16, 2015, 7:43 a.m.

Description Last Updated

  • April 12, 2017, 1:47 p.m.

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ARTAKI,I.; RAY,U.; REJENT,JEROME A. & VIANCO,PAUL T. An Evaluation of Prototype Circuit Boards Assembled with a Sn-Ag Bi Solder, article, September 1, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc619654/: accessed July 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.