Residual Stress Predictions in Polycrystalline Alumina

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Microstructure-level residual stresses arise in polycrystalline ceramics during processing as a result of thermal expansion anisotropy and crystallographic disorientation across the grain boundaries. Depending upon the grain size, the magnitude of these stresses can be sufficiently high to cause spontaneous microcracking during the processing of these materials. They are also likely to affect where cracks initiate and propagate under macroscopic loading. The magnitudes of residual stresses in untextured and textured alumina samples were predicted using object oriented finite (OOF) element analysis and experimentally determined grain orientations. The crystallographic orientations were obtained by electron-backscattered diffraction (EBSD). The residual stresses were lower ... continued below

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19 p.

Creation Information

VEDULA,VENKATA R.; GLASS,S. JILL; SAYLOR,DAVID M.; ROHRER,GREGORY S.; CARTER,W. CRAIG & LANGER,STEPHEN A. December 13, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 13 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Microstructure-level residual stresses arise in polycrystalline ceramics during processing as a result of thermal expansion anisotropy and crystallographic disorientation across the grain boundaries. Depending upon the grain size, the magnitude of these stresses can be sufficiently high to cause spontaneous microcracking during the processing of these materials. They are also likely to affect where cracks initiate and propagate under macroscopic loading. The magnitudes of residual stresses in untextured and textured alumina samples were predicted using object oriented finite (OOF) element analysis and experimentally determined grain orientations. The crystallographic orientations were obtained by electron-backscattered diffraction (EBSD). The residual stresses were lower and the stress distributions were narrower in the textured samples compared to those in the untextured samples. Crack initiation and propagation were also simulated using the Griffith fracture criterion. The grain boundary to surface energy ratios required for computations were estimated using AFM groove measurements.

Physical Description

19 p.

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OSTI as DE00015183

Medium: P; Size: 19 pages

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  • Journal Name: Journal of the American Ceramic Society; Other Information: Submitted to Journal of the American Ceramic Society

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  • Report No.: SAND99-3147J
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 15183
  • Archival Resource Key: ark:/67531/metadc618453

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  • December 13, 1999

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  • June 16, 2015, 7:43 a.m.

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  • April 7, 2017, 4:29 p.m.

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VEDULA,VENKATA R.; GLASS,S. JILL; SAYLOR,DAVID M.; ROHRER,GREGORY S.; CARTER,W. CRAIG & LANGER,STEPHEN A. Residual Stress Predictions in Polycrystalline Alumina, article, December 13, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc618453/: accessed September 25, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.