Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite Solder

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Description

The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and ... continued below

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x, 157 leaves: ill.

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Sees, Jennifer A. (Jennifer Anne) May 1993.

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This dissertation is part of the collection entitled: UNT Theses and Dissertations and was provided by UNT Libraries to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 115 times , with 5 in the last month . More information about this dissertation can be viewed below.

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  • Sees, Jennifer A. (Jennifer Anne)

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Description

The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions.

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x, 157 leaves: ill.

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  • May 1993

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  • March 26, 2014, 9:30 a.m.

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  • Jan. 30, 2015, 11:19 a.m.

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Sees, Jennifer A. (Jennifer Anne). Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite Solder, dissertation, May 1993; Denton, Texas. (digital.library.unt.edu/ark:/67531/metadc279330/: accessed October 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; .