Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints

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Description

Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was ... continued below

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xvi, 294 leaves : ill.

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Wu, Yujing May 1994.

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This dissertation is part of the collection entitled: UNT Theses and Dissertations and was provided by UNT Libraries to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 47 times . More information about this dissertation can be viewed below.

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  • Wu, Yujing

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Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was to investigate the diffusion kinetics and microstructures of six types of composite solder/copper joints.

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xvi, 294 leaves : ill.

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UNT Theses and Dissertations

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  • May 1994

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  • March 24, 2014, 8:07 p.m.

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  • Nov. 25, 2014, 5:58 p.m.

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Wu, Yujing. Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints, dissertation, May 1994; Denton, Texas. (digital.library.unt.edu/ark:/67531/metadc278545/: accessed August 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; .