Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates Page: ii
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ACKNOWLEDGMENTS
Financial support for this research was provided by the Semiconductor Research
Corporation (SRC) through the Center for Advanced Interconnect Science and
Technology (CAIST), and is gratefully acknowledged.
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Chen, Li. Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates, dissertation, December 1999; Denton, Texas. (https://digital.library.unt.edu/ark:/67531/metadc2255/m1/4/: accessed April 16, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; .