Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates Page: ii
This dissertation is part of the collection entitled: UNT Theses and Dissertations and was provided to UNT Digital Library by the UNT Libraries.
Extracted Text
The following text was automatically extracted from the image on this page using optical character recognition software:
ACKNOWLEDGMENTS
Financial support for this research was provided by the Semiconductor Research
Corporation (SRC) through the Center for Advanced Interconnect Science and
Technology (CAIST), and is gratefully acknowledged.
Upcoming Pages
Here’s what’s next.
Search Inside
This dissertation can be searched. Note: Results may vary based on the legibility of text within the document.
Tools / Downloads
Get a copy of this page or view the extracted text.
Citing and Sharing
Basic information for referencing this web page. We also provide extended guidance on usage rights, references, copying or embedding.
Reference the current page of this Dissertation.
Chen, Li. Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates, dissertation, December 1999; Denton, Texas. (https://digital.library.unt.edu/ark:/67531/metadc2255/m1/4/: accessed April 16, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; .