Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

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This article presents a novel method of in-situ investigation of the device corrosion process to capture the real time mechanistic information not obtained in standard reliability testing.

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6 p.

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Ashok Kumar, Goutham Isaac; Alptekin, John; Caperton, Joshua; Salunke, Ashish & Chyan, Oliver Ming-Ren March 26, 2021.

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This article presents a novel method of in-situ investigation of the device corrosion process to capture the real time mechanistic information not obtained in standard reliability testing.

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6 p.

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Abstract: Accelerated reliability testing of integrated circuit (IC) packages, such as wire-bonded devices, is a useful tool for predicting the lifetime corrosion behavior of real-world devices. Standard tests, such as highly accelerated stress test, involves subjecting an encapsulated device to high levels of humidity and high temperature (commonly 85–121 ⁰C and 85–100% relative humidity). A major drawback of current reliability tests is that mechanistic information of what occurs between t = 0 and device failure is not captured. A novel method of in-situ investigation of the device corrosion process was developed to capture the real time mechanistic information not obtained in standard reliability testing [1]. The simple, yet effective methodology involves:
• Immersing a micropattern or device directly into contaminant-spiked aqueous solution, and observing its morphological changes under optical microscope paired with a camera.
• Short (2–48 h) time required for testing (compared to 24–300 h of standard tests).
• No need for humidity chambers.

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  • MethodsX, 8, Elsevier Science Ltd., March 26 2021, pp. 1-6

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  • Publication Title: MethodsX
  • Volume: 8
  • Article Identifier: 101320

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UNT Scholarly Works

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  • March 26, 2021

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  • Oct. 21, 2021, 11:11 a.m.

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  • Nov. 8, 2021, 11:11 a.m.

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Ashok Kumar, Goutham Isaac; Alptekin, John; Caperton, Joshua; Salunke, Ashish & Chyan, Oliver Ming-Ren. Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application, article, March 26, 2021; (https://digital.library.unt.edu/ark:/67531/metadc1852158/: accessed July 12, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT College of Science.

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