Electrostatic Mechanism of Emission Enhancement in Hybrid Metal-semiconductor Light-emitting Heterostructures Page: 59
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THE IMAGE CHARGE EFFECT
5.1 Emission Enhancement and Applied Plasmonics
The current understanding of semiconductor carrier dynamics in the
vicinity of metals operates on the assumption that the interactions present are primarily
electrodynamic in nature. This interaction is described by the coupling of carriers to the
evanescent field of surface plasmon polaritons (SPPs) or localized surface plasmons
(LSPs). For an InGaN/GaN multi-QW system, Aluminum (Al) and Silver (Ag) are
typically used to produce a plasmonic interaction, since their plasmon resonances line
up well with the typical energies of emission of InGaN heterostructures. In these cases
Gold (Au) is generally used as a foil, to demonstrate through lack of enhancement that
the enhancement is dependent on plasmon resonance and not simply due to the
presence of a metal [6, 57].
One of the common issues with producing plasmonic enhancement in functional
light-emitting devices (LEDs) is the need to grow a p-type layer for electrical contact
above the multi-QW which acts as the source of light. Because of limitations in growth
technology, the p-type layer generally needs to be thick enough (>200nm) that it
becomes difficult to couple the SPPs in a metal thin-film to the carriers in the multi-QW.
Various approaches have been tried to-date to bypass this problem [58-60]. One of
these approaches, the experimental results of which I discuss here, involves the
implantation of metallic nanoparticles (NPs) into the inverted hexagonal pits (IHPs) that
occur naturally within InGaN/GaN multi-QW systems . By making use of the IHPs it
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Llopis, Antonio. Electrostatic Mechanism of Emission Enhancement in Hybrid Metal-semiconductor Light-emitting Heterostructures, dissertation, May 2012; Denton, Texas. (digital.library.unt.edu/ark:/67531/metadc115113/m1/69/: accessed April 30, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; .