Fatigue and thermal fatigue of Pb-Sn solder joints Page: 2 of 11
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Fatigue and Thermal.Fatigue of Pb-Sn Solder
Joints
D. Frear, D. Grivas, M. McCormack, D. Tribula, J. W. Morris, Jr.
Department of Materials Science and Mineral Engineering
University of California, Berkeley
Berkeley, CA 94720
ABSTRACa
This paper presents a fundamental investigation of the fatigue and thermal fatigue
characteristics, with an emphasis on the microstructural development during fatigue, of Sn-
Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-4OPb and
5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb
solder joints with decreasing strain and temperature. In contrast, such behavior was not
observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on
60Sn-4OPb solder cycled between -55*C and 1250C show that a coarsened region develops
in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form
within these coarsened regions. The failure mode of 60Sn-40Pb solder joints in thermal
and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or
along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb
joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints
failed after fewer cycles than 60Sn-4OPb.
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Frear, D.; Grivas, D.; McCormack, M.; Tribula, D. & Morris, J.W. Jr. Fatigue and thermal fatigue of Pb-Sn solder joints, article, January 1, 1987; [Berkeley,] California. (https://digital.library.unt.edu/ark:/67531/metadc1106510/m1/2/: accessed April 24, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.