Fatigue and thermal fatigue of Pb-Sn solder joints

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This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55/sup 0/C and 125/sup 0/C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich ... continued below

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Pages: 12

Creation Information

Frear, D.; Grivas, D.; McCormack, M.; Tribula, D. & Morris, J.W. Jr. January 1, 1987.

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Description

This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb and 5Sn-95Pb solder joints. Isothermal fatigue tests show increasing fatigue life of 60Sn-40Pb solder joints with decreasing strain and temperature. In contrast, such behavior was not observed in the isothermal fatigue of 5Sn-95Pb solder joints. Thermal fatigue results on 60Sn-40Pb solder cycled between -55/sup 0/C and 125/sup 0/C show that a coarsened region develops in the center of the joint. Both Pb-rich and Sn-rich phases coarsen, and cracks form within these coarsened regions. The failure mode 60Sn-40Pb solder joints in thermal and isothermal fatigue is similar: cracks form intergranularly through the Sn-rich phase or along Sn/Pb interphase boundaries. Extensive cracking is found throughout the 5Sn-95Pb joint for both thermal and isothermal fatigue. In thermal fatigue the 5Sn-95Pb solder joints failed after fewer cycles than 60Sn-40Pb.

Physical Description

Pages: 12

Notes

NTIS, PC A02/MF A01.

Source

  • American Institute of Metallurgical Engineers annual meeting: light metals session, Denver, CO, USA, 22 Feb 1987

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  • Other: DE87012881
  • Report No.: LBL-22837
  • Report No.: CONF-870272-6
  • Grant Number: AC03-76SF00098
  • Office of Scientific & Technical Information Report Number: 6187307
  • Archival Resource Key: ark:/67531/metadc1106510

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • January 1, 1987

Added to The UNT Digital Library

  • Feb. 22, 2018, 7:45 p.m.

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  • April 25, 2018, 5:36 p.m.

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Frear, D.; Grivas, D.; McCormack, M.; Tribula, D. & Morris, J.W. Jr. Fatigue and thermal fatigue of Pb-Sn solder joints, article, January 1, 1987; [Berkeley,] California. (digital.library.unt.edu/ark:/67531/metadc1106510/: accessed October 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.