The variability residual stresses of thick superconductor films during orthorhombic to tetragonal transformation

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YBa{sub 2}Cu{sub 3}O{sub x} thick films have been deposited by spray pyrolysis of a sol-gel on 10 cm diameter polycrystalline MgO wafers. The film thickness was built up in layers of approximately 1 {mu}m thick. The in-plane residual stresses were measured by an optical interferometry (shadow moire) method as a function of film structure. In-plane residual stress maps over the area of the wafer have been obtained. The average stress of the 5 {mu}m orthorhombic phase was 0.84 GPa. As the film transforms from the orthorhombic to the tetragonal structure, the tensile stresses decreased by 0.5 GPa.

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Pages: (9 p)

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Wu, W.; Danyluk, S. (Illinois Univ., Chicago, IL (United States). Dept. of Civil Engineering, Mechanics, and Metallurgy); Lanagan, M.T. & Poeppel, R.B. (Argonne National Lab., IL (United States)) January 1, 1992.

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YBa{sub 2}Cu{sub 3}O{sub x} thick films have been deposited by spray pyrolysis of a sol-gel on 10 cm diameter polycrystalline MgO wafers. The film thickness was built up in layers of approximately 1 {mu}m thick. The in-plane residual stresses were measured by an optical interferometry (shadow moire) method as a function of film structure. In-plane residual stress maps over the area of the wafer have been obtained. The average stress of the 5 {mu}m orthorhombic phase was 0.84 GPa. As the film transforms from the orthorhombic to the tetragonal structure, the tensile stresses decreased by 0.5 GPa.

Physical Description

Pages: (9 p)

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OSTI; NTIS; GPO Dep.

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  • 8. international conference on advanced science and technology, Argonne, IL (United States), 28 Mar 1992

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  • Other: DE92010499
  • Report No.: ANL/CP-75687
  • Report No.: CONF-9203110--2
  • Grant Number: W-31109-ENG-38
  • Office of Scientific & Technical Information Report Number: 5633801
  • Archival Resource Key: ark:/67531/metadc1093297

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  • January 1, 1992

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  • Feb. 10, 2018, 10:06 p.m.

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  • April 17, 2018, 3:40 p.m.

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Wu, W.; Danyluk, S. (Illinois Univ., Chicago, IL (United States). Dept. of Civil Engineering, Mechanics, and Metallurgy); Lanagan, M.T. & Poeppel, R.B. (Argonne National Lab., IL (United States)). The variability residual stresses of thick superconductor films during orthorhombic to tetragonal transformation, article, January 1, 1992; Illinois. (digital.library.unt.edu/ark:/67531/metadc1093297/: accessed July 17, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.