Solder fused interconnections in multilayer circuits

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Description

A new solder fusion process has been developed for production of multi-layer cables and multilayer printed wiring boards. The multilayer process consists of three steps: (1) the photo-etching fabrication of the basic flexcircuit, (2) the lamination bonding of several flexcircuit layers together, and (3) solder fusion interjoining of the exposed lands to provide electrical continuity. Solder fusion is the unique feature of the process. In the solder fusion process the multilayer assembly is never in contact with highly reactive chemicals which, if entrapped, can lead to corrosion and dielectric breakdown of the assembly. Accurate layer to layer registration can be ... continued below

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Pages: 31

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Voida, G. February 1, 1977.

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Description

A new solder fusion process has been developed for production of multi-layer cables and multilayer printed wiring boards. The multilayer process consists of three steps: (1) the photo-etching fabrication of the basic flexcircuit, (2) the lamination bonding of several flexcircuit layers together, and (3) solder fusion interjoining of the exposed lands to provide electrical continuity. Solder fusion is the unique feature of the process. In the solder fusion process the multilayer assembly is never in contact with highly reactive chemicals which, if entrapped, can lead to corrosion and dielectric breakdown of the assembly. Accurate layer to layer registration can be accomplished with the solder fusion process. A multilayer assembly produced by solder fusion can be shaped into three-dimensional configurations. The repeatable electrical continuity of solder fused interconnections in multilayer assemblies has been confirmed by microhm resistance testing. The solder fused multilayer assembly can be used very advantageously in highly sophisticated instruments and apparatus where portability, weight, bulk, environmental stability, and high reliability are critical requirements.

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Pages: 31

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  • Report No.: SAND-77-0197
  • Grant Number: E(29-1)-789
  • DOI: 10.2172/5278147 | External Link
  • Office of Scientific & Technical Information Report Number: 5278147
  • Archival Resource Key: ark:/67531/metadc1065665

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • February 1, 1977

Added to The UNT Digital Library

  • Feb. 4, 2018, 10:51 a.m.

Description Last Updated

  • March 23, 2018, 1:07 p.m.

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Voida, G. Solder fused interconnections in multilayer circuits, report, February 1, 1977; United States. (digital.library.unt.edu/ark:/67531/metadc1065665/: accessed November 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.