Removal of epoxy smear and glass fiber protrusions in multilayer printed wiring board holes was investigated. Gas plasma techniques, using a mixture of carbon tetrafluoride and oxygen, removed the eposies; however, the glass fibers were not affected.
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Removal of epoxy smear and glass fiber protrusions in multilayer printed wiring board holes was investigated. Gas plasma techniques, using a mixture of carbon tetrafluoride and oxygen, removed the eposies; however, the glass fibers were not affected.
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