Array automated assembly: Phase 2. Quarterly report
Array automated assembly: Phase 2. Quarterly report
An analysis was made of cost trade-offs for shaping modified square wafers from cylindrical crystals. For reasonably expectable silicon and sheet costs, the optimum shape will be nearer a circle than a square. Tests were conducted of the effectiveness of texture etching for removal of surface damage on sawed wafers. Four glass systems have survived preliminary screening tests for use as edge masking dielectrics. These include beta-spodumen, MgO-Al/sub 2/O/sub 3/ borosilicate, baria and titania glasses. Aluminum contact metallization does not appear promising, and six silver screen printing inks have been selected for detailed investigation. Screening tests are underway for the selection of adhesive and coating materials for the superstrate fabrication. Three adhesive candidate materials have been identified for detailed investigation.
mark.phillips@unt.edu
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