Proposed method of assembly for the BCD silicon strip vertex detector modules Page: 3 of 16
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The BCD Silicon Strip Vertex Detector is constructed of 10 identical
central region modules (Fig. 1) and 18 similar forward region modules. This
memo describes a method of assembling these modules from individual silicon
wafers. Each wafer is fitted with associated front end electronics and cables
and has been tested to insure that only good wafers reach the final assembly
The technique of cementing the wafers together is to be covered in a
separate memo and is not detailed here.
The proposed method of assembly employs a servo driven Coordinate
Measuring Machine (C.M.M.) as both an inspection device and a manipulator
to position each wafer in the assembly. Key problems the assembly system
must address are:
The final determination of allowable errors has yet to be made, but
even the most generous estimates require good design to be
achievable. Every step must be accurate and repeatable with no
accumulation of error from one step to the next. The proposed
system will contribute very little to the error budget. The final
determinant of accuracy will be the quality of the C.M.M. used.
Each wafer in the module could cost about $1,000 since the central
region modules contain 42 wafers each. A moment of carelessness
could be very expensive. The proposed assembly method depends
as little as possible on the manual skill of the assembler.
During the assembly procedure, joint areas must be available for
cementing. The fixturing used must not be so bulky that access to
joints is difficult and therefore hazardous to the fragile silicon.
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Lindenmeyer, C. Proposed method of assembly for the BCD silicon strip vertex detector modules, report, October 16, 1989; Batavia, Illinois. (https://digital.library.unt.edu/ark:/67531/metadc1053587/m1/3/: accessed May 24, 2019), University of North Texas Libraries, Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.