Diagnosis of Malfunctions in Complex Electronic Assemblies. Final Report. Page: 59 of 66
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A probe that assured positive connection to the circuit board eyelet was de-
signed and built. Figure 13 shows a sketch of the special probe. After
evaluation of this probe, it was adopted for production and inspection testers
used on the program. These probes are now used for contacting eyelet
test points on a great variety of printed wiring boards.
Drawing is approximately three
times the actual size of the probe.
Spring tension holds the probe in
position against the edge of the board.
Figure 13. The Special PC-Board Test Probe
The improvements in probes and a requirement to turn unit power off during
installation of hook-on type probes reduced probing accidents significantly.
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Losure, J. A. Diagnosis of Malfunctions in Complex Electronic Assemblies. Final Report., report, January 1, 1971; Kansas City, Missouri. (https://digital.library.unt.edu/ark:/67531/metadc1031893/m1/59/: accessed March 26, 2019), University of North Texas Libraries, Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.