Diagnosis of Malfunctions in Complex Electronic Assemblies. Final Report. Page: 35 of 66
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92 PERCENT TOTAL
PERCENTAGE OF COMPONENTS IN SEALED PACKS VERSUS PERCENTAGE OF DISCRETE COMPONENTS
COMPONENTS 82 PERCENT
8 PERCENT 82 PERCENT
PERCENTAGE OF SEALED PACKS VERSUS PERCENTAGE OF DISCRETE COMPONENTS USED IN A TYPICAL
Figure 3. Sealed Packs Used in a Typical Product Subassembly Compared
to Discrete Components Used
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Losure, J. A. Diagnosis of Malfunctions in Complex Electronic Assemblies. Final Report., report, January 1, 1971; Kansas City, Missouri. (https://digital.library.unt.edu/ark:/67531/metadc1031893/m1/35/: accessed March 21, 2019), University of North Texas Libraries, Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.