Diagnosis of Malfunctions in Complex Electronic Assemblies. Final Report. Page: 15 of 66
This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided to Digital Library by the UNT Libraries Government Documents Department.
The following text was automatically extracted from the image on this page using optical character recognition software:
assemblies. The Design Agency is using a set of these manuals as techni-
cal aids for their technicians.
The Phase 2 work was concerned with the development of diagnostic equip-
ment and processes that would improve failure isolation. Four general
categories of testers were choosen for evaluation because they were
expected to yield'significant economic and quality benefits if development
effort proved those concepts feasible. The four types of testers developed
are listed as follows:
" In-process verifiers;
" Special diagnostic testers for electronic subassemblies;
* Diagnostic testers for evaluating components; and
* A product simulator.
Isolation of component faults and manufacturing errors by evaluating indi-
vidual components on pc-board assemblies reduces the complexity of many
diagnostic problems. " The in-process tester can be designed to detect most
of the errors. Development results indicate that these testers should be
considered in the tooling definitions for future telemetry programs.
The concept of using special diagnostic testers to include special trouble-
shooting work loads proved to be both economical and feasible. A
simulator type of tester, in which typical faults could be induced and
results observed, proved useful as a training tool, but usefulness as a
diagnostic tool was limited.
The recommended troubleshooting laboratory design, which included
special-design and commercial equipment to verify component rejects and
extend diagnostic- capabilities of the inspection testers, was adopted by
The technique of using liquid crystals developed during the program to
detect hidden short circuits on pc-board assemblies has resulted in a
significant cost saving.
A electronic probe clip that contacts printed circuit board eyelets was
developed. The probe is now used regularly on production and inspection
testers to assure positive contact. The probe has a lock-on feature that
secures it to the board under test. Commercial probes used in these
applications created problems by falling free or into the unit, often causing
circuit or component damage.
Here’s what’s next.
This report can be searched. Note: Results may vary based on the legibility of text within the document.
Tools / Downloads
Get a copy of this page or view the extracted text.
Citing and Sharing
Basic information for referencing this web page. We also provide extended guidance on usage rights, references, copying or embedding.
Reference the current page of this Report.
Losure, J. A. Diagnosis of Malfunctions in Complex Electronic Assemblies. Final Report., report, January 1, 1971; Kansas City, Missouri. (https://digital.library.unt.edu/ark:/67531/metadc1031893/m1/15/: accessed March 24, 2019), University of North Texas Libraries, Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.