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Development and Evaluation of High-Temperature Tungsten Alloys: Quarterly Report Number 3, April - June 1960

Description: Quarterly report describing progress on a project to develop and evaluate high-temperature tungsten alloys. This report discusses experimentation with fabrication to improve thermal stability of tested combinations by further alloying.
Date: August 10, 1960
Creator: Holtz, F. C. & Van Thyne, R. J.
Partner: UNT Libraries Government Documents Department
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Development and Evaluation of High-Temperature Tungsten Alloys : Summary Report

Description: Abstract: "Tungsten-rich alloys, developed for use at temperatures up to 2000F, exhibit ductility, fabricability and joinability not found in commercially-available materials. An envelope type of microstructure was produced in compositions containing at least 90 wt% tungsten by liquid-phase sintering of cold-pressed powders in hydrogen. At room temperature the alloys could be rolled extensively, and tensile elongations up to 25% were noted. Strength properties of a W-Ni-Fe base were improved by… more
Date: November 12, 1959
Creator: Holtz, F. C. & Van Thyne, R. J.
Partner: UNT Libraries Government Documents Department
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Development and Evaluation of High-Temperature Tungsten Alloys: Quarterly Report Number 2, January - March 1960

Description: Quarterly report describing progress on a project to develop and evaluate high-temperature tungsten alloys. This report discusses properties for specific base alloys at room temperature and under high temperatures.
Date: June 24, 1960
Creator: Holtz, F. C. & Van Thyne, R. J.
Partner: UNT Libraries Government Documents Department
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Development and Evaluation of High-Temperature Tungsten Alloys : Final Report, October 1, 1960 - September 30, 1960

Description: This report summarizes investigations taken between October 1, 1959, to September 30, 1960 with the objectives of developing high-tungsten alloys which are readily fabricable into massive and complex shapes and which possess adequate strength for operation at temperatures up to 2000 F. Within this report, studies are divided into two main categories: alloy development and material fabrication techniques
Date: December 14, 1960
Creator: Holtz, F. C. & Van Thyne, R. J.
Partner: UNT Libraries Government Documents Department
open access

Process Evaluation and Characterization of Tungsten Nitride as a Diffusion Barrier for Copper Interconnect Technology

Description: The integration of copper (Cu) and dielectric materials has been outlined in the International Technology Roadmap for Semiconductors (ITRS) as a critical goal for future microelectronic devices. A necessity toward achieving this goal is the development of diffusion barriers that resolve the Cu and dielectric incompatibility. The focus of this research examines the potential use of tungsten nitride as a diffusion barrier by characterizing the interfacial properties with Cu and evaluating its p… more
Date: August 2005
Creator: Ekstrom, Bradley Mitsuharu
Partner: UNT Libraries
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