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Influence of design and coatings on the mechanical reliability of semiconductor wafers.

Description: We investigate some of the mechanical design factors of wafers and the effect on strength. Thin, solid, pre-stressed films are proposed as a means to improve the bulk mechanical properties of a wafer. Three-point bending was used to evaluate the laser scribe density and chemical processing effect on wafer strength. Drop and strike tests were employed to investigate the edge bevel profile effect on the mechanical properties of the wafer. To characterize the effect of thin films on stren… more
Date: August 2002
Creator: Yoder, Karl J.
Item Type: Refine your search to only Thesis or Dissertation
Partner: UNT Libraries

Cure Kinetics and Processing Parameters of Neat and Reinforced High Performance Epoxy Resins: Evaluation of Techniques

Description: Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high performance epoxy prepreg composed of the tetrafunctional epoxy tetraglycidyl 4,4-diaminodiphenyl methane (TGDDM), the tetrafunctional amine curing agent 4,4’-diaminodiphenylsulfone (DDS) and an ionic initiator/accelerator, are determined by various thermal analysis techniques and the results compared. The reaction is monitored by heat generated determined by differential scanning calorimetry (DSC). … more
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Date: December 1999
Creator: Bilyeu, Bryan
Item Type: Refine your search to only Thesis or Dissertation
Partner: UNT Libraries
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