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 Degree Discipline: Materials Science and Engineering
 Collection: UNT Theses and Dissertations
Supercritical Silylation and Stability of Silyl Groups

Supercritical Silylation and Stability of Silyl Groups

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Date: May 2006
Creator: Nerusu, Pawan Kumar
Description: Methylsilsesquioxane (MSQ) and organosilicate glass (OSG) are the materials under this study because they exhibit the dielectric constant values necessary for future IC technology requirements. Obtaining a low-k dielectric value is critical for the IC industry in order to cope time delay and cross talking issues. These materials exhibit attractive dielectric value, but there are problems replacing conventional SiO2, because of their chemical, mechanical and electrical instability after plasma processing. Several techniques have been suggested to mitigate process damage but supercritical silylation offers a rapid single repair step solution to this problem. Different ash and etch damaged samples were employed in this study to optimize an effective method to repair the low-k dielectric material and seal the surface pores via supercritical fluid processing with various trialkylchlorosilanes. Fourier transform infrared spectroscopy (FTIR), contact angle, capacitance- voltage measurements, and x-ray photoemission spectroscopy, dynamic secondary ion mass spectroscopy (DSIMS), characterized the films. The hydrophobicity and dielectric constant after exposure to elevated temperatures and ambient conditions were monitored and shown to be stable. The samples were treated with a series of silylating agents of the form R3-Si-Cl where R is an alkyl groups (e.g. ethyl, propyl, isopropyl). Reactivity with the surface hydroxyls was inversely ...
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Synthesis and Characterization of Crystalline Assemblies of Functionalized Hydrogel Nanoparticles

Synthesis and Characterization of Crystalline Assemblies of Functionalized Hydrogel Nanoparticles

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Date: December 2005
Creator: Cai, Tong
Description: Two series monodispersed nanoparticles of hydroxylpropyl cellulose (HPC) and functionalized poly-N-isopropylamide (PNIPAM) particles have been synthesized and used as building blocks for creating three-dimensional networks, with two levels of structural hierarchy. The first level is HPC nanoparticles were made from methacrylated or degradable cross-linker attached HPC. These nanoparticles could be stabilized at room temperature by residual methacrylate or degradable groups are present both within and on the exterior of HPC nanoparticles. Controlled release studies have been performed on the particle and networks .The nearly monodispersed nanoparticles have been synthesized on the basis of a natural polymer of hydropropylcellulose (HPC) with a high molecular weight using the precipitation polymerization method and self-assembly of these particles in water results in bright colors. The HPC nanoparticles can be potential using as crosslinkers to increase the hydrogels mechanical properties, such as high transparency and rapid swelling/de-swelling kinetics. The central idea is to prepare colloidal particles containing C=C bonds and to use them as monomers - vinylparticles, to form stable particle assemblies with various architectures. This is accomplished by mixing an aqueous suspension of hydrogel nanoparticles (PNIPAM-co-allylamine) with the organic solvent (dichloromethane) to grow columnar crystals. The hydrogels with such a unique crystal structure behavior ...
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Thermoplastic and Thermoset Natural Fiber Composite and Sandwich Performance

Thermoplastic and Thermoset Natural Fiber Composite and Sandwich Performance

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Date: May 2014
Creator: Yang, Bing
Description: The objective of this thesis is to investigate the effects of adding natural fiber (kenaf fiber, retted kenaf fiber, and sugarcane fiber) into polymer materials. The effects are obtained by considering three main parts. 1. Performance in thermoplastic composites. The effect of fiber retting on polymer composite crystallization and mechanical performance was investigated. PHBV/PBAT in 80/20 blend ratio was modified using 5% by weight kenaf fiber. Dynamic mechanical analysis of the composites was done to investigate the glass transition and the modulus at sub-ambient and ambient temperatures. ESEM was conducted to analyze fiber topography which revealed smoother surfaces on the pectinase retted fibers. 2. Performance in thermoset composites. The effect of the incorporation of natural fibers of kenaf and of sugarcane combined with the polyester resin matrix is investigated. A comparison of mechanical properties of kenaf polyester composite, sugarcane polyester composite and pure polyester in tensile, bending, dynamic mechanical thermal analysis (DMA) and moisture test on performance is measured.. 3. Performance in sandwich composites. The comparison of the performance characteristics and mechanical properties of natural fiber composites panels with soft and rigid foam cores are evaluated. A thorough test of the mechanical behavior of composites sandwich materials in tensile, bending ...
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Topics in micro electromechanical systems: MEMS engineering and alternative materials for MEMS fabrication.

Topics in micro electromechanical systems: MEMS engineering and alternative materials for MEMS fabrication.

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Date: August 2004
Creator: Chapla, Kevin
Description: This paper deals with various topics in micro electromechanical systems (MEMS) technology beginning with microactuation, MEMS processing, and MEMS design engineering. The fabrication and testing of three separate MEMS devices are described. The first two devices are a linear stepping motor and a continuous rotary motor, respectively; and were designed for the purpose of investigating the frictional and wear properties of silicon components. The third device is a bi-stable microrelay, in which electrical current conducts through a secondary circuit, via a novel probe-interconnect mechanism. The second half focuses on engineering a carbon nanotube / SU-8 photoepoxy nanocomposite for fabricating MEMS devices. A processing method for this material as well as the initial results of characterization, are discussed.
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Tribological Behavior of Spark Plasma Sintered Tic/graphite/nickel Composites and Cobalt Alloys

Tribological Behavior of Spark Plasma Sintered Tic/graphite/nickel Composites and Cobalt Alloys

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Date: December 2013
Creator: Kinkenon, Douglas
Description: Monolithic composites are needed that combine low friction and wear, high mechanical hardness, and high fracture toughness. Thin films and coatings are often unable to meet this engineering challenge as they can delaminate and fracture during operation ceasing to provide beneficial properties during service life. Two material systems were synthesized by spark plasma sintering (SPS) and were studied for their ability to meet these criteria. A dual hybrid composite was fabricated and consisted of a nickel matrix for fracture toughness, TiC for hardness and graphite for solid/self‐lubrication. An in‐situ reaction during processing resulted in the formation of TiC from elemental Ti and C powders. The composition was varied to determine its effects on tribological behavior. Stellite 21, a cobalt‐chrome‐molybdenum alloy, was also produced by SPS. Stellite 21 has low stacking fault energy and a hexagonal phase which forms during sliding that both contribute to low interfacial shear and friction. Samples were investigated by x‐ray diffraction (XRD), scanning electron microscopy (SEM), energy dispersive x‐ray spectroscopy (EDS), and electron back‐scattered diffraction (EBSD). Tribological properties were characterized by pin on disc tribometry and wear rates were determined by profilometry and abrasion testing. Solid/self‐lubrication in the TiC/C/Ni system was investigated by Raman and Auger ...
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A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield

A Wet Etch Release Method for Silicon Microelectromechanical Systems (MEMS) Using Polystyrene Microspheres for Improved Yield

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Date: May 2004
Creator: Mantiziba, Fadziso
Description: One of the final steps in fabricating microelectromechanical devices often involves a liquid etch release process. Capillary forces during the liquid evaporation stage after the wet etch process can pull two surfaces together resulting in adhesion of suspended microstructures to the supporting substrate. This release related adhesion can greatly reduce yields. In this report, a wet etch release method that uses polystyrene microspheres in the final rinse liquid is investigated. The polystyrene microspheres act as physical barriers between the substrate and suspended microstructures during the final liquid evaporation phase. A plasma ashing process is utilized to completely remove the polystyrene microspheres from the microstructure surfaces. Using this process, release yields > 90% were achieved. It is found that the surface roughness of gold surfaces increases while that of the silicon is reduced due to a thin oxide that grows on the silicon surface during the plasma process.
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