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 Degree Discipline: Materials Science
Mechanical Properties of Polymer Modified Mortar

Mechanical Properties of Polymer Modified Mortar

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Date: August 2002
Creator: Palos, Artemio
Description: The mechanical properties of the polymer-modified mortar are markedly improved over conventional cement mortar. We utilized recycled ABS in powder form and a polymer latex emulsion, polymer percentage ranges from 0 to 25 percent by polymer/cement ratio were investigated. The mechanical properties investigated were compression strength and adhesion strength. Compression strength effects did not have an impact on adhesion strength. Adhesion strength was calculated with pullout testing apparatus designed by the author. Results indicate that recycled ABS had a lower adhesive strength than the acrylic latex emulsion and the base mortar, but did increase in adhesive strength when mixed with maleic-anhydride. The adhesive strength was investigated for a Fiber Reinforced Polymer (FRP) made of an "E" glass fiber that is a continuous strand roving oriented and pre-tensioned longitudinally in an isopthalic polyester matrix material. The FRP rebar was compared to standard steel rebars, and found that the standard steel corrugated rebar had a higher adhesive strength, due to mechanical interlocking. This was clarified by measurements using a smooth steel rebar. Characterization of the polymer-modified mortar was conducted by pore analysis and scanning electron microscopy. Scanning Electron Microscopy was implemented to view the polymer particles, the cement fibrils formed by the ...
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Fabrication of MOS capacitor and transitor structure using contact photolithography.

Fabrication of MOS capacitor and transitor structure using contact photolithography.

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Date: August 2002
Creator: Su, Danni
Description: This problem in lieu of thesis report describes a practical photolithographic method to produce micro patterns on metal-oxide-semiconductor or metal-oxide-semiconductor-metal layers for electrical measurements. The desired patterns are then transferred from the photo mask to the photoresist-coated metal film by exposure, followed by wet etching. In the procedure described in this report, it was observed that microstructures as small as 27 mm with an edge roughness of ~ 2 mm can be reproducibly generated with this process. MOS capacitors and transistors structures can be fabricated by using this technique. The method described in this report requires access to only simple facilities so that it is relatively inexpensive, and the overall time required for the whole process is short.
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Application of thermomechanical characterization techniques to bismuth telluride based thermoelectric materials

Application of thermomechanical characterization techniques to bismuth telluride based thermoelectric materials

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Date: August 2002
Creator: White, John B.
Description: The thermoelectric properties of bismuth telluride based thermoelectric (TE) materials are well-characterized, but comparatively little has been published on the thermomechanical properties. In this paper, dynamic mechanical analysis (DMA) and differential scanning calorimetry data for bismuth telluride based TE materials is presented. The TE materials' tan delta values, indicative of viscoelastic energy dissipation modes, approached that of glassy or crystalline polymers, were greater than ten times the tan delta of structural metals, and reflected the anisotropic nature of TE materials. DMA thermal scans showed changes in mechanical properties versus temperature with clear hysteresis effects. These results showed that the application of DMA techniques are useful for evaluation of thermophysical and thermomechanical properties of these TE materials.
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Influence of design and coatings on the mechanical reliability of semiconductor wafers.

Influence of design and coatings on the mechanical reliability of semiconductor wafers.

Date: August 2002
Creator: Yoder, Karl J.
Description: We investigate some of the mechanical design factors of wafers and the effect on strength. Thin, solid, pre-stressed films are proposed as a means to improve the bulk mechanical properties of a wafer. Three-point bending was used to evaluate the laser scribe density and chemical processing effect on wafer strength. Drop and strike tests were employed to investigate the edge bevel profile effect on the mechanical properties of the wafer. To characterize the effect of thin films on strength, one-micron ceramic films were deposited on wafers using PECVD. Coated samples were prepared by cleaving and were tested using four-point bending. Film adhesion was characterized by notched four-point bending. RBS and FTIR were used to obtain film chemistry, and nanoindentation was used to investigate thin film mechanical properties. A stress measurement gauge characterized residual film stress. Mechanical properties of the wafers correlated to the residual stress in the film.
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Deposition and characterization of pentacene film.

Deposition and characterization of pentacene film.

Date: December 2003
Creator: Singh, Nidhi
Description: Many organic materials have been studied to be used as semiconductors, few of them being pentacene and polythiophene. Organic semiconductors have been investigated to make organic thin film transistors. Pentacene has been used in the active region of the transistors. Transistors fabricated with pentacene do not have very high mobility. But in some applications, high mobility is not needed. In such application other properties of organic transistors are used, such as, ease of production and flexibility. Organic thin film transistors (OTFT) can find use as low density storage devices, such as smart cards or I.D. tags, and displays. OTFT are compatible with polymeric substrates and hence can find use as flexible computer screens. This project aims at making 'smart clothes', the cheap way, with pentacene based OTFT. This problem in lieu of thesis describes a way to deposit pentacene films and characterize it. Pentacene films were deposited on substrates and characterized using x-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR). The substrate used was ~1500Å platinum on silicon wafer or bare silicon wafer. was used. A deposition system for vacuum deposition of pentacene was assembled. The XRD data for deposited pentacene films shows the presence of two phases, single ...
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Characterizaton of Triethoxyfluorosilane and Tetraethoxysilane Based Aerogels

Characterizaton of Triethoxyfluorosilane and Tetraethoxysilane Based Aerogels

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Date: December 2001
Creator: Roepsch, Jodi Ann
Description: Aerogels are highly porous, low dielectric constant (low k) materials being considered by the semiconductor industry as an interlayer dielectric. Low k materials are needed to overcome capacitance problems that limit device feature sizes. Precursors triethoxyfluorosilane (TEFS) and tetraethoxysilane (TEOS) were used to prepare bulk aerogels. Samples were prepared by sol-gel methods, and then carbon dioxide supercritically-dried. Effects of varying the water to precursor ratio were studied with respect to aerogel properties and microstructure. Methods of analysis for this study include FTIR-ATR, TEM, RBS, EDS, SEM, dielectric constant determination by impedance and surface area by gas adsorption. Si-F bonds were determined to be present in both acid- and base-catalyzed TEFS as well as HF-catalyzed TEOS. Fluorine promotes a fractal network microstructure as opposed to a particle-like microstructure. Surface area and dielectric constant were determined to increase slightly with increases in the water to precursor ratio.
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Hypotheses for Scratch Behavior of Polymer Systems that Recover

Hypotheses for Scratch Behavior of Polymer Systems that Recover

Date: May 2002
Creator: Bujard, Bernard
Description: Scratch recovery is a desirable property of many polymer systems. The reason why some materials have demonstrated excellent scratch recovery while others do not has been a mystery. Explaining the scratch resistance based upon the hardness of a material or its crosslink density is incorrect. In this thesis, novel polymers were tested in an attempt to discover materials that show excellent scratch recovery - one of the most important parameters in determining the wear of a material. Several hypotheses were developed in an attempt to give an accurate picture of how the chemical structure of a polymer affects its scratch recovery. The results show that high scratch recovery is a complex phenomenon not solely dependent upon the presence of electronegative atoms such as fluorine.
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Materials properties of hafnium and zirconium silicates: Metal interdiffusion and dopant penetration studies.

Materials properties of hafnium and zirconium silicates: Metal interdiffusion and dopant penetration studies.

Date: August 2002
Creator: Quevedo-Lopez, Manuel Angel
Description: Hafnium and Zirconium based gate dielectrics are considered potential candidates to replace SiO2 or SiON as the gate dielectric in CMOS processing. Furthermore, the addition of nitrogen into this pseudo-binary alloy has been shown to improve their thermal stability, electrical properties, and reduce dopant penetration. Because CMOS processing requires high temperature anneals (up to 1050 °C), it is important to understand the diffusion properties of any metal associated with the gate dielectric in silicon at these temperatures. In addition, dopant penetration from the doped polysilicon gate into the Si channel at these temperatures must also be studied. Impurity outdiffusion (Hf, Zr) from the dielectric, or dopant (B, As, P) penetration through the dielectric into the channel region would likely result in deleterious effects upon the carrier mobility. In this dissertation extensive thermal stability studies of alternate gate dielectric candidates ZrSixOy and HfSixOy are presented. Dopant penetration studies from doped-polysilicon through HfSixOy and HfSixOyNz are also presented. Rutherford backscattering spectroscopy (RBS), heavy ion RBS (HI-RBS), x-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HR-TEM), and time of flight and dynamic secondary ion mass spectroscopy (ToF-SIMS, D-SIMS) methods were used to characterize these materials. The dopant diffusivity is calculated by modeling ...
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Polymer hydrogel nanoparticles and their networks

Polymer hydrogel nanoparticles and their networks

Date: August 2002
Creator: Lu, Xihua
Description: The thermally responsive hydroxypropyl cellulose (HPC) hydrogel nanoparticles have been synthesized and characterized. The HPC particles were obtained by chemically crosslinking collapsed HPC polymer chains in water-surfactant (dodecyltrimethylammonium bromide) dispersion above the lower critical solution temperature (LCST) of the HPC. The size distributions of microgel particles, measured by dynamic light scattering, have been correlated with synthesis conditions including surfactant concentration, polymer concentration, and reaction temperature. The swelling and phase transition properties of resultant HPC microgels have been analyzed using both static and dynamic light scattering techniques. By first making gel nanoparticles and then covalently bonding them together, we have engineered a new class of gels with two levels of structural hierarchy: the primary network is crosslinked polymer chains in each individual particle, while the secondary network is a system of crosslinked nanoparticles. The covalent bonding contributes to the structural stability of the nanostructured gels, while self-assembly provides them with crystal structures that diffract light, resulting in colors. By using N-isopropylacrylamide copolymer hydrogel nanoparticles, we have synthesized nanoparticle networks that display a striking iridescence like precious opal but are soft and flexible like gelatin. This is in contrast to previous colored hydrogels, which were created either by adding dyes or fluorescent, ...
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Epoxy + liquid crystalline epoxy coreacted networks

Epoxy + liquid crystalline epoxy coreacted networks

Date: December 2000
Creator: Punchaipetch, Prakaipetch
Description: Molecular reinforcement through in-situ polymerization of liquid crystalline epoxies (LCEs) and a non-liquid crystalline epoxy has been investigated. Three LCEs: diglycidyl ether of 4,4'-dihydroxybiphenol (DGE-DHBP) and digylcidyl ether of 4-hydroxyphenyl-4"-hydroxybiphenyl-4'-carboxylate (DGE-HHC), were synthesized and blended with diglycidyl ether of bisphenol F (DGEBP-F) and subsequently cured with anhydride and amine curing agents. Curing kinetics were determined using differential scanning calorimetry (DSC). Parameters for autocatalytic curing kinetics of both pure monomers and blended systems were determined. The extent of cure for both monomers was monitored by using Fourier transform infrared spectroscopy (FT-IR). The glass transitions were evaluated as a function of composition using DSC and dynamic mechanical analysis (DMA). The results show that the LC constituent affects the curing kinetics of the epoxy resin and that the systems are highly miscible. The effects of molecular reinforcement of DGEBP-F by DGE-DHBP and DGE-HHC were investigated. The concentration of the liquid crystalline moiety affects mechanical properties. Tensile, impact and fracture toughness tests results are evaluated. Scanning electron microscopy of the fracture surfaces shows changes in failure mechanisms compared to the pure components. Results indicate that mechanical properties of the blended samples are improved already at low concentration by weight of the LCE added into ...
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