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  Partner: UNT Libraries
 Department: Department of Chemistry
 Decade: 1990-1999
Explorations with polycarbocyclic cage compounds

Explorations with polycarbocyclic cage compounds

Date: August 1999
Creator: Chong, Hyun-Soon
Description: A variety of novel cage-functionalized pyridyl containing crown ethers have been prepared for use in selective alkali metal complexation studies. A highly preorganized, cage-functionalized cryptand also has been designed and has been synthesized for use as a selective Li+ complexant. The alkali metal picrate extraction profiles of these cage-functionalized crown ethers also have been studied. Novel cage-functionalized diazacrown ethers have been prepared for selective alkali metal complexation studies. Alkali metal picrate extraction experiments have been performed by using this new class of synthetic ionophores to investigate the effects of cage-annulation and the influence of N-pivot lariat sidearms upon their resulting complexation properties. Novel pyridyl containing calix[4]arene receptors were prepared. Analysis of their respective 1H NMR and 13C NMR spectra suggests that calix[4]arene moieties in the ligand occupy the cone conformation. The complexation properties of these host molecules were estimated by performing a series of alkali metal picrate extraction experiments. An optically active cage-functionalized crown ether which contains a binaphthyl moiety as the chiral unit was prepared. The ability of the resulting optically active crown ether to distinguish between enantiomers of guest ammonium ions (i.e., phenylethylamonium and phenylglycinate salts) in transport experiments was investigated. Hexacyclo[11.2.1.02,12.05,10.05,15.010,14]hexadeca-6,8-diene-4,11-dione was prepared from hexacyclo[7.4.2.01,9.03,7.04,14.06,15] pentadeca-10,12-diene-2,8-dione. Unanticipated ...
Contributing Partner: UNT Libraries
Adhesion/diffusion barrier layers for copper integration: carbon-silicon polymer films and tantalum substrates

Adhesion/diffusion barrier layers for copper integration: carbon-silicon polymer films and tantalum substrates

Date: December 1999
Creator: Chen, Li
Description: The Semiconductor Industry Association (SIA) has identified the integration of copper (Cu) with low-dielectric-constant (low-k) materials as a critical goal for future interconnect architectures. A fundamental understanding of the chemical interaction of Cu with various substrates, including diffusion barriers and adhesion promoters, is essential to achieve this goal. The objective of this research is to develop novel organic polymers as Cu/low-k interfacial layers and to investigate popular barrier candidates, such as clean and modified tantalum (Ta) substrates. Carbon-silicon (C-Si) polymeric films have been formed by electron beam bombardment or ultraviolet (UV) radiation of molecularly adsorbed vinyl silane precursors on metal substrates under ultra-high vacuum (UHV) conditions. Temperature programmed desorption (TPD) studies show that polymerization is via the vinyl groups, while Auger electron spectroscopy (AES) results show that the polymerized films have compositions similar to the precursors. Films derived from vinyltrimethyl silane (VTMS) are adherent and stable on Ta substrates until 1100 K. Diffusion of deposited Cu overlayers is not observed below 800 K, with dewetting occurred only above 400 K. Hexafluorobenzene moieties can also be incorporated into the growing film with good thermal stability. Studies on the Ta substrates demonstrate that even sub-monolayer coverages of oxygen or carbide on polycrystalline ...
Contributing Partner: UNT Libraries