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  Partner: UNT Libraries
 Department: Department of Materials Science
 Degree Discipline: Materials Science
 Collection: UNT Theses and Dissertations
Application of thermomechanical characterization techniques to bismuth telluride based thermoelectric materials

Application of thermomechanical characterization techniques to bismuth telluride based thermoelectric materials

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Date: August 2002
Creator: White, John B.
Description: The thermoelectric properties of bismuth telluride based thermoelectric (TE) materials are well-characterized, but comparatively little has been published on the thermomechanical properties. In this paper, dynamic mechanical analysis (DMA) and differential scanning calorimetry data for bismuth telluride based TE materials is presented. The TE materials' tan delta values, indicative of viscoelastic energy dissipation modes, approached that of glassy or crystalline polymers, were greater than ten times the tan delta of structural metals, and reflected the anisotropic nature of TE materials. DMA thermal scans showed changes in mechanical properties versus temperature with clear hysteresis effects. These results showed that the application of DMA techniques are useful for evaluation of thermophysical and thermomechanical properties of these TE materials.
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Characterization of methyltrimethoxysilane sol-gel polymerization and the resulting aerogels.

Characterization of methyltrimethoxysilane sol-gel polymerization and the resulting aerogels.

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Date: August 2003
Creator: Dong, Hanjiang
Description: Methyl-functionalized porous silica is of considerable interest as a low dielectric constant film for semiconductor devices. The structural development of these materials appears to affect their gelation behaviors and impact their mechanical properties and shrinkage during processing. 29Si solution NMR was used to follow the structural evolution of MTMS (methyltrimethoxysilane) polymerization to gelation or precipitation, and thus to better understand the species that affect these properties and gelation behaviors. The effects of pH, water concentration, type of solvents, and synthesis procedures (single step acid catalysis and two-step acid/base catalysis) on MTMS polymerization were discussed. The reactivity of silicon species with different connectivity and the extent of cyclization were found to depend appreciably on the pH value of the sol. A kinetic model is presented to treat the reactivity of both silicon species involved in condensations separately based on the inductive and steric effects of these silicon species. Extensive cyclization in the presence of acid, which was attributed to the steric effects among numerous reaction pathways for the first time, prevents MTMS gelation, whereas gels were obtained from the two-step method with nearly random condensations. The experimental degree of condensation (DC) at the gel point using the two-step procedure was determined ...
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Characterizaton of Triethoxyfluorosilane and Tetraethoxysilane Based Aerogels

Characterizaton of Triethoxyfluorosilane and Tetraethoxysilane Based Aerogels

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Date: December 2001
Creator: Roepsch, Jodi Ann
Description: Aerogels are highly porous, low dielectric constant (low k) materials being considered by the semiconductor industry as an interlayer dielectric. Low k materials are needed to overcome capacitance problems that limit device feature sizes. Precursors triethoxyfluorosilane (TEFS) and tetraethoxysilane (TEOS) were used to prepare bulk aerogels. Samples were prepared by sol-gel methods, and then carbon dioxide supercritically-dried. Effects of varying the water to precursor ratio were studied with respect to aerogel properties and microstructure. Methods of analysis for this study include FTIR-ATR, TEM, RBS, EDS, SEM, dielectric constant determination by impedance and surface area by gas adsorption. Si-F bonds were determined to be present in both acid- and base-catalyzed TEFS as well as HF-catalyzed TEOS. Fluorine promotes a fractal network microstructure as opposed to a particle-like microstructure. Surface area and dielectric constant were determined to increase slightly with increases in the water to precursor ratio.
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Cure kinetics and processing parameters of neat and reinforced high performance epoxy resins : evaluation of techniques

Cure kinetics and processing parameters of neat and reinforced high performance epoxy resins : evaluation of techniques

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Date: December 1999
Creator: Bilyeu, Bryan
Description: Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high performance epoxy prepreg composed of the tetrafunctional epoxy tetraglycidyl 4,4-diaminodiphenyl methane (TGDDM), the tetrafunctional amine curing agent 4,4’-diaminodiphenylsulfone (DDS) and an ionic initiator/accelerator, are determined by various thermal analysis techniques and the results compared. The reaction is monitored by heat generated determined by differential scanning calorimetry (DSC). The changes in physical properties indicating increasing conversion are followed by shifts in glass transition temperature determined by DSC and temperature-modulated DSC (TMDSC), thermomechanical (TMA) and dynamic mechanical (DMA) analysis and thermally stimulated depolarization (TSD). Changes in viscosity, also indicative of degree of conversion, are monitored by DMA. Thermal stability as a function of degree of cure is monitored by thermogravimetric analysis (TGA). The parameters of the general kinetic equations, including activation energy and rate constant, are explained and used to compare results of various techniques. The utilities of the kinetic descriptions are demonstrated in the construction of a useful time-temperature-transformation (TTT) diagram for rapid determination of processing parameters in the processing of prepregs. Copyright is held by the author, unless otherwise noted. All rights reserved. Files: Thesis.pdf Special Conditions
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The effects of color concentrate in polyolefins.

The effects of color concentrate in polyolefins.

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Date: December 2001
Creator: Flora, Paul
Description: Throughout history consumer products were generally manufactured from wood and metal. They either had to hold their natural color or become subject to painting. When plastics entered the industry, it was recognized for its ease of shaping, re-usability, physical properties and its low cost. One of plastics' greatest benefits is its ability to hold a given color from within allowing it to avoid use of paint. This paper will give a brief overview on the effects of pigments when incorporated in a polyolefin. It will provide a classification of the main types of pigments and how each effect the properties of the product through: crystallization, weatherability, opacity, coloristic values and of course viscosity.
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The Electron Emission Characteristics of Aluminum, Molybdenum and Carbon Nanotubes Studied by Field Emission and Photoemission.

The Electron Emission Characteristics of Aluminum, Molybdenum and Carbon Nanotubes Studied by Field Emission and Photoemission.

Date: December 2002
Creator: Sosa, Edward Delarosa
Description: The electron emission characteristics of aluminum, molybdenum and carbon nanotubes were studied. The experiments were setup to study the emission behavior as a function of temperature and exposure to oxygen. Changes in the surface work function as a result of thermal annealing were monitored with low energy ultra-violet photoelectron spectroscopy for flat samples while field emission energy distributions were used on tip samples. The change in the field emission from fabricated single tips exposed to oxygen while in operation was measured using simultaneous Fowler-Nordheim plots and electron energy distributions. From the results a mechanism for the degradation in the emission was concluded. Thermal experiments on molybdenum and aluminum showed that these two materials can be reduced at elevated temperatures, while carbon nanotubes on the other hand show effects of oxidation. To purely reduce molybdenum a temperature in excess of 750 ºC is required. This temperature exceeds that allowed by current display device technology. Aluminum on the other hand shows reduction at a much lower temperature of at least 125 ºC; however, its extreme reactivity towards oxygen containing species produces re-oxidation. It is believed that this reduction is due to the outward diffusion of aluminum atoms through the oxide. Carbon nanotubes ...
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Epoxy + liquid crystalline epoxy coreacted networks

Epoxy + liquid crystalline epoxy coreacted networks

Date: December 2000
Creator: Punchaipetch, Prakaipetch
Description: Molecular reinforcement through in-situ polymerization of liquid crystalline epoxies (LCEs) and a non-liquid crystalline epoxy has been investigated. Three LCEs: diglycidyl ether of 4,4'-dihydroxybiphenol (DGE-DHBP) and digylcidyl ether of 4-hydroxyphenyl-4"-hydroxybiphenyl-4'-carboxylate (DGE-HHC), were synthesized and blended with diglycidyl ether of bisphenol F (DGEBP-F) and subsequently cured with anhydride and amine curing agents. Curing kinetics were determined using differential scanning calorimetry (DSC). Parameters for autocatalytic curing kinetics of both pure monomers and blended systems were determined. The extent of cure for both monomers was monitored by using Fourier transform infrared spectroscopy (FT-IR). The glass transitions were evaluated as a function of composition using DSC and dynamic mechanical analysis (DMA). The results show that the LC constituent affects the curing kinetics of the epoxy resin and that the systems are highly miscible. The effects of molecular reinforcement of DGEBP-F by DGE-DHBP and DGE-HHC were investigated. The concentration of the liquid crystalline moiety affects mechanical properties. Tensile, impact and fracture toughness tests results are evaluated. Scanning electron microscopy of the fracture surfaces shows changes in failure mechanisms compared to the pure components. Results indicate that mechanical properties of the blended samples are improved already at low concentration by weight of the LCE added into ...
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Fabrication of MOS capacitor and transitor structure using contact photolithography.

Fabrication of MOS capacitor and transitor structure using contact photolithography.

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Date: August 2002
Creator: Su, Danni
Description: This problem in lieu of thesis report describes a practical photolithographic method to produce micro patterns on metal-oxide-semiconductor or metal-oxide-semiconductor-metal layers for electrical measurements. The desired patterns are then transferred from the photo mask to the photoresist-coated metal film by exposure, followed by wet etching. In the procedure described in this report, it was observed that microstructures as small as 27 mm with an edge roughness of ~ 2 mm can be reproducibly generated with this process. MOS capacitors and transistors structures can be fabricated by using this technique. The method described in this report requires access to only simple facilities so that it is relatively inexpensive, and the overall time required for the whole process is short.
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Hypotheses for Scratch Behavior of Polymer Systems that Recover

Hypotheses for Scratch Behavior of Polymer Systems that Recover

Date: May 2002
Creator: Bujard, Bernard
Description: Scratch recovery is a desirable property of many polymer systems. The reason why some materials have demonstrated excellent scratch recovery while others do not has been a mystery. Explaining the scratch resistance based upon the hardness of a material or its crosslink density is incorrect. In this thesis, novel polymers were tested in an attempt to discover materials that show excellent scratch recovery - one of the most important parameters in determining the wear of a material. Several hypotheses were developed in an attempt to give an accurate picture of how the chemical structure of a polymer affects its scratch recovery. The results show that high scratch recovery is a complex phenomenon not solely dependent upon the presence of electronegative atoms such as fluorine.
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Influence of design and coatings on the mechanical reliability of semiconductor wafers.

Influence of design and coatings on the mechanical reliability of semiconductor wafers.

Date: August 2002
Creator: Yoder, Karl J.
Description: We investigate some of the mechanical design factors of wafers and the effect on strength. Thin, solid, pre-stressed films are proposed as a means to improve the bulk mechanical properties of a wafer. Three-point bending was used to evaluate the laser scribe density and chemical processing effect on wafer strength. Drop and strike tests were employed to investigate the edge bevel profile effect on the mechanical properties of the wafer. To characterize the effect of thin films on strength, one-micron ceramic films were deposited on wafers using PECVD. Coated samples were prepared by cleaving and were tested using four-point bending. Film adhesion was characterized by notched four-point bending. RBS and FTIR were used to obtain film chemistry, and nanoindentation was used to investigate thin film mechanical properties. A stress measurement gauge characterized residual film stress. Mechanical properties of the wafers correlated to the residual stress in the film.
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