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- Analyses of Particulate Contaminants in Semiconductor Processing Fluids
- Particle contamination control is a critical issue for the semiconductor industry. In the near future, this industry will be concerned with the chemical identities of contaminant particles as small as 0.01 pm in size. Therefore, analytical techniques with both high chemical sensitivity and spatial resolution are required. Transmission electron microscopy (TEM) provides excellent spatial resolution and yields structural and compositional information. It is rarely used, however, due to the difficulty of sample preparation. The goals of this research are to promote the use of TEM as an ultrafine particle analysis tool by developing new sample preparation methods, and to exploit the new TEM techniques for analysis of particles in semiconductor processing fluids. A TEM methodology for the analysis of particulate contaminants in fluids with an elemental detectability limit as low as 0.1 part per trillion (ppt), and a particle concentration detectability limit as low as 1 particle/ml for particles greater than 0.2 pm was developed and successfully applied to the analysis of particles in HF, H202, de-ionized (DI) water, and on the surface of an electronic device. HF samples from three manufacturers were examined. For HF (B), the maximum particle concentration was 8.3 x 103 particles/ml. Both a viscous material and lath-shaped particles were observed. The Sb concentration was less than 0.6 part per billion (ppb). HF (C) was the cleanest. CaF2 and TiO2 particles were identified in HF (D). For H2 02, iron and tin oxides and hydroxides were identified. The maximum particle concentration was 990 particles/ml. The Sn and Fe concentrations were less than 0.3 ppb. Spherical and dendritic particles were observed. For DI water, spherical and dendritic particles (<2 particles/ml), and particles containing Fe or Si with concentrations less than 0.1 ppt were observed. Contaminants on an electronic device surface were also analyzed. Clusters of small particles were determined to be a mixture of aluminum oxides and aluminum silicates.
- Analysis of Thermoplastic Polyimide + Polymer Liquid Crystal Blends
- Thermoplastic polyimides (TPIs) exhibit high glass transition temperatures (Tgs), which make them useful in high performance applications. Amorphous and semicrystalline TPIs show sub-Tg relaxations, which can aid in improving strength characteristics through energy absorption. The a relaxation of both types of TPIs indicates a cooperative nature. The semicrystalline TPI shows thermo-irreversible cold crystallization phenomenon. The polymer liquid crystal (PLC) used in the blends is thermotropic and with longitudinal molecular structure. The small heat capacity change (ACP) associated with the glass transition indicates the PLC to be rigid rod in nature. The PLC shows a small endotherm associated with the melting. The addition of PLC to the semicrystalline TPI does not significantly affect the Tg or the melting point (Tm). The cold crystallization temperature (Tc) increases with the addition of the PLC, indicating channeling phenomenon. The addition of PLC also causes a negative deviation of the ACP, which is another evidence for channeling. The TPI, PLC and their blends show high thermal stability. The semicrystalline TPI absorbs moisture; this effect decreases with the addition of the PLC. The absorbed moisture does not show any effect on the degradation. The addition of PLC beyond 30 wt.% does not result in an improvement of properties. The amorphous TPI + PLC blends also show the negative deviation of ACP from linearity with composition. The addition of PLC causes a decrease in the thermal conductivity in the transverse direction to the PLC orientation. The thermomechanical analysis indicates isotropic expansivity for the amorphous TPI and a small anisotropy for the semicrystalline TPI. The PLC shows large anisotropy in expansivity. Even 5 wt. % concentration of PLC in the blend induces considerable anisotropy in the expansivity. Thus, blends show controllable expansivity through PLC concentration. Amorphous TPI + PLC blends also show excellent film formability. The amorphous TPI blends show good potential for applications requiring high thermal stability, controlled expansivity and good film formability.
- Cure Kinetics and Processing Parameters of Neat and Reinforced High Performance Epoxy Resins: Evaluation of Techniques
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Kinetic equation parameters for the curing reaction of a commercial glass fiber reinforced high performance epoxy prepreg composed of the tetrafunctional epoxy tetraglycidyl 4,4-diaminodiphenyl methane (TGDDM), the tetrafunctional amine curing agent 4,4-diaminodiphenylsulfone (DDS) and an ionic initiator/accelerator, are determined by various thermal analysis techniques and the results compared. The reaction is monitored by heat generated determined by differential scanning calorimetry (DSC). The changes in physical properties indicating increasing conversion are followed by shifts in glass transition temperature determined by DSC and temperature-modulated DSC (TMDSC), thermomechanical (TMA) and dynamic mechanical (DMA) analysis and thermally stimulated depolarization (TSD). Changes in viscosity, also indicative of degree of conversion, are monitored by DMA. Thermal stability as a function of degree of cure is monitored by thermogravimetric analysis (TGA). The parameters of the general kinetic equations, including activation energy and rate constant, are explained and used to compare results of various techniques. The utilities of the kinetic descriptions are demonstrated in the construction of a useful time-temperature-transformation (TTT) diagram for rapid determination of processing parameters in the processing of prepregs. Copyright is held by the author, unless otherwise noted. All rights reserved. Files: Thesis.pdf Special Conditions