You limited your search to:

  Partner: UNT Libraries
 Department: Department of Chemistry
 Degree Discipline: Chemistry
 Degree Level: Doctoral
 Collection: UNT Theses and Dissertations
Adhesion/diffusion barrier layers for copper integration: carbon-silicon polymer films and tantalum substrates

Adhesion/diffusion barrier layers for copper integration: carbon-silicon polymer films and tantalum substrates

Date: December 1999
Creator: Chen, Li
Description: The Semiconductor Industry Association (SIA) has identified the integration of copper (Cu) with low-dielectric-constant (low-k) materials as a critical goal for future interconnect architectures. A fundamental understanding of the chemical interaction of Cu with various substrates, including diffusion barriers and adhesion promoters, is essential to achieve this goal. The objective of this research is to develop novel organic polymers as Cu/low-k interfacial layers and to investigate popular barrier candidates, such as clean and modified tantalum (Ta) substrates. Carbon-silicon (C-Si) polymeric films have been formed by electron beam bombardment or ultraviolet (UV) radiation of molecularly adsorbed vinyl silane precursors on metal substrates under ultra-high vacuum (UHV) conditions. Temperature programmed desorption (TPD) studies show that polymerization is via the vinyl groups, while Auger electron spectroscopy (AES) results show that the polymerized films have compositions similar to the precursors. Films derived from vinyltrimethyl silane (VTMS) are adherent and stable on Ta substrates until 1100 K. Diffusion of deposited Cu overlayers is not observed below 800 K, with dewetting occurred only above 400 K. Hexafluorobenzene moieties can also be incorporated into the growing film with good thermal stability. Studies on the Ta substrates demonstrate that even sub-monolayer coverages of oxygen or carbide on polycrystalline ...
Contributing Partner: UNT Libraries
Aldohaloketenes and the Stereochemistry of Aldohaloketene Cycloadditions

Aldohaloketenes and the Stereochemistry of Aldohaloketene Cycloadditions

Date: May 1970
Creator: Hoff, Edwin Frank
Description: The objective of this research problem was to synthesize aldohaloketenes and investigate the chemistry of this new class of ketenes.
Contributing Partner: UNT Libraries
Aromatic Amino Acid Studies

Aromatic Amino Acid Studies

Date: December 1970
Creator: Sullivan, Patrick Timothy
Description: Pyridine ring analogs of the aromatic amino acids phenylalanine and tyrosine were synthesized and studied in microbiological and mammalian systems.
Contributing Partner: UNT Libraries
Biological Inhibitors

Biological Inhibitors

Date: December 1971
Creator: Sargent, Dale Roger
Description: Four isosteric series of plant growth-regulating compounds were prepared. Using an Avena sativa coleptile assay system, derivatives in series I and IV inhibited segment elongation to a greater degree than did comparable derivatives in series II and III.
Contributing Partner: UNT Libraries
Bonding Studies in Group IV Substituted n,n-dimethylanilines

Bonding Studies in Group IV Substituted n,n-dimethylanilines

Date: December 1971
Creator: Drews, Michael James
Description: The purpose of the present work is to study the effects of the trimethylsilyl and trimethylgermyl substituents on the N,N-dimethylamino ring system. Both ground and excited state interactions were studied and their magnitudes determined. The experimental data were then used in conjunction with molecular orbital calculations to differentiate among, and determine the importance of, d-p bonding, hyperconjugation or polarization of the trimethylsilyl group on the ground and excited state bonding.
Contributing Partner: UNT Libraries
Computational Study of Small Molecule Activation via Low-Coordinate Late First-Row Transition Metal Complexes

Computational Study of Small Molecule Activation via Low-Coordinate Late First-Row Transition Metal Complexes

Date: May 2010
Creator: Pierpont, Aaron
Description: Methane and dinitrogen are abundant precursors to numerous valuable chemicals such as methanol and ammonia, respectively. However, given the robustness of these substrates, catalytically circumventing the high temperatures and pressures required for such transformations has been a challenging task for chemists. In this work, computational studies of various transition metal catalysts for methane C-H activation and N2 activation have been carried out. For methane C-H activation, catalysts of the form LnM=E are studied, where Ln is the supporting ligand (dihydrophosphinoethane or β-diketiminate), E the activating ligand (O, NCH3, NCF3) at which C-H activation takes place, and M the late transition metal (Fe,Co,Ni,Cu). A hydrogen atom abstraction (HAA) / radical rebound (RR) mechanism is assumed for methane functionalization (CH4 à CH3EH). Since the best energetics are found for (β-diket)Ni=O and (β-diket)Cu=O catalysts, with or without CF3 substituents around the supporting ligand periphery, complete methane-to-methanol cycles were studied for such systems, for which N2O was used as oxygen atom transfer (OAT) reagent. Both monometallic and bimetallic OAT pathways are addressed. Monometallic Fe-N2 complexes of various supporting ligands (LnFe-N2) are studied at the beginning of the N2 activation chapter, where the effect of ligand on N2 activation in end-on vs. side-on N2 isomers ...
Contributing Partner: UNT Libraries
Conformationally Stable Cyclohexyllithium Compounds

Conformationally Stable Cyclohexyllithium Compounds

Date: January 1968
Creator: Selman, Charles Melvin
Description: Organolitnium compounds have been employed in synthetic worK for many years. However only during the last decade has much progress been made in establishing the mechanistic pathways for the reactions of these compounds.
Contributing Partner: UNT Libraries
The Crystal and Molecular Structures of 8-Hydroxyquinoline-N-Oxide and 2-Hydroxymethylpyridine-N-Oxide

The Crystal and Molecular Structures of 8-Hydroxyquinoline-N-Oxide and 2-Hydroxymethylpyridine-N-Oxide

Date: June 1970
Creator: Terry, John Christopher
Description: This dissertation looked at the crystal structure analysis of 2-hydroxymethylpyridine-N-oxide sine this compound could provide data on both substituent effects and hydrogen bonding.
Contributing Partner: UNT Libraries
The Crystal and Molecular Structures of Tri-(p-Fluorophenyl)-Amine and Tri-(p-Iodophenyl)-Amine

The Crystal and Molecular Structures of Tri-(p-Fluorophenyl)-Amine and Tri-(p-Iodophenyl)-Amine

Date: January 1970
Creator: Freeman, Gerald R. (Gerald Richard)
Description: Because of the need for data on the geometry of nitrogen in arylamines, the determination of the crystal and molecular structures of tri-(p-fluorophenyl)-amine (TFPA) and tri-(p-iodophenyl)-amine (TIPA) was undertaken as the subject of this dissertation.
Contributing Partner: UNT Libraries
Diffusion barriers/adhesion promoters. Surface and interfacial studies of copper and copper-aluminum alloys

Diffusion barriers/adhesion promoters. Surface and interfacial studies of copper and copper-aluminum alloys

Date: August 2000
Creator: Shepherd, Krupanand Solomon
Description: The focus of this research is to study the interaction between copper and the diffusion barrier/adhesion promoter. The behavior of copper sputter-deposited onto sputter-cleaned tantalum nitride is investigated. The data show that copper growth on tantalum nitride proceeds with the formation of 3-D islands, indicating poor adhesion characteristics between copper and Ta0.4N. Post-annealing experiments indicate that copper will diffuse into Ta0.4N at 800 K. Although the data suggests that Ta0.4N is effective in preventing copper diffusion, copper's inability to wet Ta0.4N will render this barrier ineffective. The interaction of copper with oxidized tantalum silicon nitride (O/TaSiN) is characterized. The data indicate that initial copper depositions result in the formation a conformal ionic layer followed by Cu(0) formation in subsequent depositions. Post-deposition annealing experiments performed indicate that although diffusion does not occur for temperatures less than 800 K, copper "de-wetting" occurs for temperatures above 500 K. These results indicate that in conditions where the substrate has been oxidized facile de-wetting of copper may occur. The behavior of a sputter-deposited Cu0.6Al0.4 film with SiO2 (Cu0.6Al0.4/SiO2) is investigated. The data indicate that aluminum segregates to the SiO2 interface and becomes oxidized. For copper coverages less than ~ 0.31 ML (based on a Cu/O ...
Contributing Partner: UNT Libraries
FIRST PREV 1 2 3 4 5 NEXT LAST