Characterization of Post-Plasma Etch Residues and Plasma Induced Damage Evaluation on Patterned Porous Low-K Dielectrics Using MIR-IR Spectroscopy
Description:
As the miniaturization of functional devices in integrated circuit (IC) continues to scale down to sub-nanometer size, the process complexity increases and makes materials characterization difficult. One of our research effort demonstrates the development and application of novel Multiple Internal Reflection Infrared Spectroscopy (MIR-IR) as a sensitive (sub-5 nm) metrology tool to provide precise chemical bonding information that can effectively guide through the development of more efficient …
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Date:
May 2016
Creator:
Rimal, Sirish
Partner:
UNT Libraries