The Interactions of Plasma with Low-k Dielectrics: Fundamental Damage and Protection Mechanisms Metadata

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Title

  • Main Title The Interactions of Plasma with Low-k Dielectrics: Fundamental Damage and Protection Mechanisms

Creator

  • Author: Behera, Swayambhu Prasad
    Creator Type: Personal

Contributor

  • Chair: Kelber, Jeffry A.
    Contributor Type: Personal
    Contributor Info: Major Professor
  • Committee Member: Du, Jincheng
    Contributor Type: Personal
  • Committee Member: Rout, Bibhudutta
    Contributor Type: Personal
  • Chair: Weathers, Duncan L.
    Contributor Type: Personal
    Contributor Info: Co-Major Professor

Publisher

  • Name: University of North Texas
    Place of Publication: Denton, Texas
    Additional Info: Web: www.unt.edu

Date

  • Creation: 2011-08

Language

  • English

Description

  • Content Description: Nanoporous low-k dielectrics are used for integrated circuit interconnects to reduce the propagation delays, and cross talk noise between metal wires as an alternative material for SiO2. These materials, typically organosilicate glass (OSG) films, are exposed to oxygen plasmas during photoresist stripping and related processes which substantially damage the film by abstracting carbon, incorporating O and OH, eventually leading to significantly increased k values. Systematic studies have been performed to understand the oxygen plasma-induced damage mechanisms on different low-k OSG films of various porosity and pore interconnectedness. Fourier transform infrared spectroscopy, x-ray photoelectron spectroscopy and atomic force microscopy are used to understand the damage kinetics of O radicals, ultraviolet photons and charged species, and possible ways to control the carbon loss from the film. FTIR results demonstrate that O radical present in the plasma is primarily responsible for carbon abstraction and this is governed by diffusion mechanism involving interconnected film nanopores. The loss of carbon from the film can be controlled by closing the pore interconnections, He plasma pretreatment is an effective way to control the damage at longer exposure by closing the connections between the pores.

Subject

  • Keyword: Low-k dielectrics
  • Keyword: He plasma
  • Keyword: O2 plasma
  • Keyword: carbon abstraction
  • Keyword: plasma damage
  • Keyword: AFM
  • Keyword: FTIR
  • Keyword: nanoporous ULK

Collection

  • Name: UNT Theses and Dissertations
    Code: UNTETD

Institution

  • Name: UNT Libraries
    Code: UNT

Rights

  • Rights Access: public
  • Rights Holder: Behera, Swayambhu Prasad
  • Rights License: copyright
  • Rights Statement: Copyright is held by the author, unless otherwise noted. All rights reserved.

Resource Type

  • Thesis or Dissertation

Format

  • Text

Identifier

  • Accession or Local Control No: behera_swayambhu_p
  • Archival Resource Key: ark:/67531/metadc84175

Degree

  • Degree Grantor: University of North Texas
  • Academic Department: Doctor of Physics
  • Degree Discipline: Physics
  • Degree Level: Doctoral
  • Degree Name: Doctor of Philosophy
  • Degree Publication Type: disse
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