Electrodeposition of adherent copper film on unmodified tungsten. Metadata

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Title

  • Main Title Electrodeposition of adherent copper film on unmodified tungsten.

Creator

  • Author: Wang, Chen
    Creator Type: Personal

Contributor

  • Chair: Kelber, Jeffry A.
    Contributor Type: Personal
    Contributor Info: Major Professor
  • Committee Member: Jacob, Tom
    Contributor Type: Personal
    Contributor Info: Minor Professor
  • Committee Member: Omary, Mohammad
    Contributor Type: Personal

Publisher

  • Name: University of North Texas
    Place of Publication: Denton, Texas

Date

  • Creation: 2004-05
  • Digitized: 2007-11-15

Language

  • English

Description

  • Content Description: Adherent Cu films were electrodeposited onto polycrystalline W foils from purged solutions of 0.05 M CuSO4 in H2SO4 supporting electrolyte and 0.025 M CuCO3∙Cu(OH)2 in 0.32 M H3BO3 and corresponding HBF4 supporting electrolyte, both at pH = 1. Films were deposited under constant potential conditions at voltages between -0.6 V and -0.2 V vs Ag/AgCl. All films produced by pulses of 10 s duration were visible to the eye, copper colored, and survived a crude test called "the Scotch tape test", which stick the scotch tape on the sample, then peel off the tape and see if the copper film peels off or not. Characterization by scanning electron microscopy (SEM), energy dispersive X-ray (EDX) and X-ray photon spectroscopy (XPS) confirmed the presence of metallic Cu, with apparent dendritic growth. No sulfur impurity was observable by XPS or EDX. Kinetics measurements indicate that the Cu nucleation process in the sulfuric bath is slower than in the borate bath. In both baths, nucleation kinetics do not correspond to either instantaneous or progressive nucleation. Films deposited from 0.05 M CuSO4/H2SO4 solution at pH > 1 at -0.2 V exhibited poor adhesion and decreased Cu reduction current. In both borate and sulfate baths, small Cu nuclei are observable by SEM upon deposition at higher negative overpotentials, while only large nuclei (~ 1 micron or larger) are observed upon deposition at less negative potentials.

Subject

  • Library of Congress Subject Headings: Electroplating.
  • Library of Congress Subject Headings: Copper.
  • Library of Congress Subject Headings: Tungsten.
  • Library of Congress Subject Headings: Thin films.
  • Keyword: copper
  • Keyword: tungsten
  • Keyword: electrodeposition

Collection

  • Name: UNT Theses and Dissertations
    Code: UNTETD

Institution

  • Name: UNT Libraries
    Code: UNT

Rights

  • Rights Access: unt_strict
  • Rights License: copyright
  • Rights Holder: Wang, Chen
  • Rights Statement: Copyright is held by the author, unless otherwise noted. All rights reserved.

Resource Type

  • Thesis or Dissertation

Format

  • Text

Identifier

  • OCLC: 55874225
  • Archival Resource Key: ark:/67531/metadc5541

Degree

  • Degree Name: Master of Science
  • Degree Level: Master's
  • Degree Discipline: Analytical Chemistry
  • Academic Department: Department of Chemistry
  • Degree Grantor: University of North Texas

Note

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