Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate Page: 49
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solution, and the influence of C104 is so small that do not need to count it in
the experiments. The result is similar as the oxidized ruthenium electrode in
2mM CuSO4 solution, the UPD and bulk peak still there, which means that the
SO42- may help to build the UPD peak, but it is not critical reason for the UPD
peak formation. It also excludes the suspicion that the UPD peak actually is the
absorption of SO42- and no copper at all. The monolayer of UPD peak in figure
3.11 is about 0.57 ML, which is smaller than the monolayer in 2mM CuSO4
solution. One of reasons is that the CIO4- does not coadbsorb easily on the
oxidized ruthenium electrode surface with copper atoms.
The oxidized surface of ruthenium electrode may help to build the first
monolayer of copper deposition much easier by comparing the bare ruthenium
electrode in the same solution. From ignoring the anions influence, the bulk
peak will be higher on the oxidized ruthenium electrode in the same conditions.
It means that the efficiency of copper deposition is better on the oxidized
ruthenium electrode. One of the explanations is that the electroactive area
increase after the oxidization. By using the equation 1.1, the calculation of the
area of oxidized ruthenium electrode is two times as big as the ruthenium
electrode (the original one).49
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Huang, Long. Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate, thesis, December 2003; Denton, Texas. (https://digital.library.unt.edu/ark:/67531/metadc4416/m1/61/: accessed April 24, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; .