Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate Page: 42
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800
600
E 400
S200
0
-200
-400
-0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5
E /V (vs Ag/AgCI)
Figure3.5 Oxidized polycrystalline ruthenium electrodes in 10mM CuSO4 with
0.5M H2SO4 as the electrolyte. Scan rate = 20 mV/s.
The oxidized ruthenium electrode in different concentration of CuSO4 is to
test the monolayer of Copper UPD existence and see the bulk peak shift. It is
reasonable to assume that the UPD influences the further growth of the bulk
peak. For the UPD peak shifts less than the bulk peak, it means that deposition
of bulk copper on oxidized ruthenium electrode is becoming easier in high
concentration of CuSO4. From these data, the first monolayer is not completed
under the potential of -0.01V, and the second layer and next few layers are
from the bulk peak.42
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Huang, Long. Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate, thesis, December 2003; Denton, Texas. (https://digital.library.unt.edu/ark:/67531/metadc4416/m1/54/: accessed April 19, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; .