Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate Page: 12
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Figure 1.8 Electrodes on steel puck (black) by wax for polishing
Last steps will help me to polish the electrode with different silicon carbide
(SiC) pads and diamond suspensions. From the coarse step to the fine grind,
each step need 2 minutes. After using the different polishing pad and diamond
suspensions, I finished the steps and get a perfect electrode. Every working
electrode is cleaned in 0.5M H2SO4 by 20 cycles of CV from -0.5V to 0.6V
before the experiments.
1.5 Experiment equipments and chemicals
1.5.1 Chemical
All electrochemical experiments were performed by using a polycrystalline
ruthenium or iridium electrode. The counter electrode (CE) was a platinum coil
cleaned by 15% HNO3 from fisher scientific. The reference electrode (RE) was
silver-silver chloride electrode (Ag/AgCI) from CH instrument.
Water was purified in a Millipore Milli-Q Elix5 ultrapure water system (>
18.2 MO/cm). The supporting electrolyte was either 0.5 M H2S04 or 0.5M
K2S04 (from fisher scientific). Both of them are the ACS grade chemicals. The
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Huang, Long. Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate, thesis, December 2003; Denton, Texas. (https://digital.library.unt.edu/ark:/67531/metadc4416/m1/24/: accessed April 18, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; .